Publication detail

The Quality of BGA Solder Joint with Underfill

SKÁCEL, J. OTÁHAL, A. ŘIHÁK, P. SZENDIUCH, I.

Original Title

The Quality of BGA Solder Joint with Underfill

Type

conference paper

Language

English

Original Abstract

This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

Keywords

BGA, solder balls, underfill, reflow soldering

Authors

SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I.

Released

12. 12. 2016

ISBN

978-80-214-5419-4

Book

Sborník IMAPS flash Conference 2016

ISBN

1802-4564

Periodical

ElectroScope - http://www.electroscope.zcu.cz

Year of study

2016

Number

3

State

Czech Republic

Pages from

19

Pages to

22

Pages count

36

BibTex

@inproceedings{BUT130695,
  author="Josef {Skácel} and Alexandr {Otáhal} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="The Quality of BGA Solder Joint with Underfill",
  booktitle="Sborník IMAPS flash Conference 2016",
  year="2016",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="2016",
  number="3",
  pages="19--22",
  isbn="978-80-214-5419-4",
  issn="1802-4564"
}