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SKÁCEL, J. OTÁHAL, A. ŘIHÁK, P. SZENDIUCH, I.
Original Title
The Quality of BGA Solder Joint with Underfill
Type
conference paper
Language
English
Original Abstract
This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.
Keywords
BGA, solder balls, underfill, reflow soldering
Authors
SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I.
Released
12. 12. 2016
ISBN
978-80-214-5419-4
Book
Sborník IMAPS flash Conference 2016
1802-4564
Periodical
ElectroScope - http://www.electroscope.zcu.cz
Year of study
2016
Number
3
State
Czech Republic
Pages from
19
Pages to
22
Pages count
36
BibTex
@inproceedings{BUT130695, author="Josef {Skácel} and Alexandr {Otáhal} and Pavel {Řihák} and Ivan {Szendiuch}", title="The Quality of BGA Solder Joint with Underfill", booktitle="Sborník IMAPS flash Conference 2016", year="2016", journal="ElectroScope - http://www.electroscope.zcu.cz", volume="2016", number="3", pages="19--22", isbn="978-80-214-5419-4", issn="1802-4564" }