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SZENDIUCH, I. HURBAN, M.
Original Title
Reflow Soldering in Vapour Phase Systems
Type
conference paper
Language
English
Original Abstract
IMAPS FLASH CONFERENCE 2016 is international conference for young scientist and industry experts in area of microelectronics packaging and interconnection. This area is very important and decisive for design of modrn electronic systems and circuits
Keywords
Reflow soldering, solder alloy, reliability , soldering process
Authors
SZENDIUCH, I.; HURBAN, M.
Released
3. 11. 2016
Publisher
Novpress s.r.o.
Location
Brno
ISBN
978-80-214-5416-3
Book
2nd IMAPS FLASH CONFERENCE 2016
Edition
1
Edition number
Pages from
42
Pages to
43
Pages count
96
BibTex
@inproceedings{BUT130743, author="Ivan {Szendiuch} and Milan {Hurban}", title="Reflow Soldering in Vapour Phase Systems", booktitle="2nd IMAPS FLASH CONFERENCE 2016", year="2016", series="1", number="1", pages="42--43", publisher="Novpress s.r.o.", address="Brno", isbn="978-80-214-5416-3" }