Publication detail
ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS
VALA, M.
Original Title
ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS
English Title
ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS
Type
conference paper
Language
Czech
Original Abstract
This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.
English abstract
This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages, eg.: modern x-ray defect detection.
Keywords
X-ray, Defect, Analysis, X-plane, Void
Key words in English
X-ray, Defect, Analysis, X-plane, Void
Authors
VALA, M.
Released
30. 4. 2016
ISBN
978-80-214-5350-0
Book
Proceedings of the 22nd Conference STUDENT EEICT 2016
Pages from
206
Pages to
208
Pages count
789
URL
BibTex
@inproceedings{BUT130790,
author="Martin {Vala}",
title="ANALYSIS OF DEFECTS ON PCB USING X-RAY,
3D SW CERA AND MICRO-SECTIONS",
booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
year="2016",
pages="206--208",
isbn="978-80-214-5350-0",
url="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf"
}