Detail publikace

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

VALA, M.

Originální název

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Anglický název

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.

Anglický abstrakt

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages, eg.: modern x-ray defect detection.

Klíčová slova

X-ray, Defect, Analysis, X-plane, Void

Klíčová slova v angličtině

X-ray, Defect, Analysis, X-plane, Void

Autoři

VALA, M.

Vydáno

30. 4. 2016

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference STUDENT EEICT 2016

Strany od

206

Strany do

208

Strany počet

789

URL

http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf

BibTex

@inproceedings{BUT130790,
  author="Martin {Vala}",
  title="ANALYSIS OF DEFECTS ON PCB USING X-RAY, 
3D SW CERA AND MICRO-SECTIONS",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="206--208",
  isbn="978-80-214-5350-0",
  url="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf"
}