Publication detail

Modeling and Analysis of Fault-Tolerant Systems by Means of UPPAAL SMC: Method and Benefits

STRNADEL, J.

Original Title

Modeling and Analysis of Fault-Tolerant Systems by Means of UPPAAL SMC: Method and Benefits

Type

article in a collection out of WoS and Scopus

Language

English

Original Abstract

The paper presents a method of modeling and analysis of fault-tolerant (FT) electronic systems by means of a novel statistical model checking (SMC) approach available in the UPPAAL SMC tool. The method can be seen as an alternative to classical analytic approaches based on instruments such as fault-tree or Markov reliability models of the above-specified systems. Main goal of the paper is to show that - taking the advantage of SMC - the reliability analysis of systems can be facilitated even for adverse conditions such as inconstant failure (hazard) rate of inner system components. In the paper, basic terms and principles related to modeling and analysis of FT systems are summarized, followed by a short introduction to the UPPAAL SMC tool, its practical applicability to analysis and modeling of basic FT systems and evaluation of the results achieved on basis of the tool.

Keywords

modeling, analysis, fault tolerant, FT, statistical model checking, SMC, UPPAAL SMC, reliability analysis, probability distribution, bathtub, fault, transient, permanent, intermittent, behavior, type, description, signalization, scenario, tripple modular redundancy, TMR

Authors

STRNADEL, J.

Released

20. 4. 2016

Publisher

Slovak University of Technology in Bratislava

Location

Bratislava

ISBN

978-80-8086-256-5

Book

Informal Proceedings of the 2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)

Pages from

32

Pages to

37

Pages count

6

URL

https://www.fit.vut.cz/research/publication/11073/

BibTex

@inproceedings{BUT130933,
  author="Josef {Strnadel}",
  title="Modeling and Analysis of Fault-Tolerant Systems by Means of UPPAAL SMC: Method and Benefits",
  booktitle="Informal Proceedings of the 2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)",
  year="2016",
  pages="32--37",
  publisher="Slovak University of Technology in Bratislava",
  address="Bratislava",
  isbn="978-80-8086-256-5",
  url="https://www.fit.vut.cz/research/publication/11073/"
}

Documents

strnadel_cr03_web.pdf