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NOVOTNÝ, V. VALA, R. ŠANDERA, J.
Original Title
The Analysis of Ceramic Resistor Arrays in SMT
Type
conference paper
Language
English
Original Abstract
This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.
Keywords
Resistor, Arrays, Solder joint, Reliability, SAC305, ANSYS, Cycling
Authors
NOVOTNÝ, V.; VALA, R.; ŠANDERA, J.
Released
1. 6. 2017
ISBN
978-80-214-5496-5
Book
Proceedings of the 23rd Conference STUDENT EEICT 2017
Edition
2017
Edition number
první
Pages from
550
Pages to
554
Pages count
5
BibTex
@inproceedings{BUT139341, author="Václav {Novotný} and Radek {Vala} and Josef {Šandera}", title="The Analysis of Ceramic Resistor Arrays in SMT", booktitle="Proceedings of the 23rd Conference STUDENT EEICT 2017", year="2017", series="2017", number="první", pages="550--554", isbn="978-80-214-5496-5" }