Detail publikace

The Analysis of Ceramic Resistor Arrays in SMT

NOVOTNÝ, V. VALA, R. ŠANDERA, J.

Originální název

The Analysis of Ceramic Resistor Arrays in SMT

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.

Klíčová slova

Resistor, Arrays, Solder joint, Reliability, SAC305, ANSYS, Cycling

Autoři

NOVOTNÝ, V.; VALA, R.; ŠANDERA, J.

Vydáno

1. 6. 2017

ISBN

978-80-214-5496-5

Kniha

Proceedings of the 23rd Conference STUDENT EEICT 2017

Edice

2017

Číslo edice

první

Strany od

550

Strany do

554

Strany počet

5

BibTex

@inproceedings{BUT139341,
  author="Václav {Novotný} and Radek {Vala} and Josef {Šandera}",
  title="The Analysis of Ceramic Resistor Arrays in SMT",
  booktitle="Proceedings of the 23rd Conference STUDENT EEICT 2017",
  year="2017",
  series="2017",
  number="první",
  pages="550--554",
  isbn="978-80-214-5496-5"
}