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KACÁLEK, P. PETŘÍČEK, T.
Original Title
Analysis of interaction of the soil temperature field and structures at the level of the basement of the building
Type
journal article - other
Language
English
Original Abstract
The article describes an analysis of the effect of soil type on temperature field distribution at the level of family house basement. Regarding engineering calculations (heat loss calculation, designing and evaluating constructions), a simple and generally accepted method to determine the course of temperature field adjacent to basement walls is missing. The methods specified in European standards are, in terms of calculation of heat flows in soil, problematic. There is currently an insufficient number of measured values which could be integrated in a simple calculation method. A certain option concerns continual measuring of temperatures in soil for buildings in situ. The article uses the measurements of soil temperatures in winter in pre-determined depths at the buidling parts in contact with soil. The measured data from a two-year period were integrated in the model on the basis of statistical evaluation. The main aim of the article is to generate an impulse to create unified outcomes of temperatures of certain soils for pre-selected depths, building structures, and parameters of indoor and outdoor environment.
Keywords
soil, temperature, temperature field
Authors
KACÁLEK, P.; PETŘÍČEK, T.
Released
22. 1. 2018
Publisher
EDP Sciences
Location
France
ISBN
2261-236X
Periodical
MATEC Web of Conferences
Year of study
146
Number
03003
State
French Republic
Pages from
1
Pages to
6
Pages count
URL
https://doi.org/10.1051/matecconf/201814603003
Full text in the Digital Library
http://hdl.handle.net/11012/196421
BibTex
@article{BUT140502, author="Petr {Kacálek} and Tomáš {Petříček}", title="Analysis of interaction of the soil temperature field and structures at the level of the basement of the building", journal="MATEC Web of Conferences", year="2018", volume="146", number="03003", pages="1--6", doi="10.1051/matecconf/201814603003", issn="2261-236X", url="https://doi.org/10.1051/matecconf/201814603003" }