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KACÁLEK, P. PETŘÍČEK, T.
Originální název
Analysis of interaction of the soil temperature field and structures at the level of the basement of the building
Typ
článek v časopise - ostatní, Jost
Jazyk
angličtina
Originální abstrakt
The article describes an analysis of the effect of soil type on temperature field distribution at the level of family house basement. Regarding engineering calculations (heat loss calculation, designing and evaluating constructions), a simple and generally accepted method to determine the course of temperature field adjacent to basement walls is missing. The methods specified in European standards are, in terms of calculation of heat flows in soil, problematic. There is currently an insufficient number of measured values which could be integrated in a simple calculation method. A certain option concerns continual measuring of temperatures in soil for buildings in situ. The article uses the measurements of soil temperatures in winter in pre-determined depths at the buidling parts in contact with soil. The measured data from a two-year period were integrated in the model on the basis of statistical evaluation. The main aim of the article is to generate an impulse to create unified outcomes of temperatures of certain soils for pre-selected depths, building structures, and parameters of indoor and outdoor environment.
Klíčová slova
soil, temperature, temperature field
Autoři
KACÁLEK, P.; PETŘÍČEK, T.
Vydáno
22. 1. 2018
Nakladatel
EDP Sciences
Místo
France
ISSN
2261-236X
Periodikum
MATEC Web of Conferences
Ročník
146
Číslo
03003
Stát
Francouzská republika
Strany od
1
Strany do
6
Strany počet
URL
https://doi.org/10.1051/matecconf/201814603003
Plný text v Digitální knihovně
http://hdl.handle.net/11012/196421
BibTex
@article{BUT140502, author="Petr {Kacálek} and Tomáš {Petříček}", title="Analysis of interaction of the soil temperature field and structures at the level of the basement of the building", journal="MATEC Web of Conferences", year="2018", volume="146", number="03003", pages="1--6", doi="10.1051/matecconf/201814603003", issn="2261-236X", url="https://doi.org/10.1051/matecconf/201814603003" }