Publication detail

Influence of heat flow direction on solder ball interfacial layer

OTÁHAL, A. SZENDIUCH, I.

Original Title

Influence of heat flow direction on solder ball interfacial layer

Type

journal article in Web of Science

Language

English

Original Abstract

This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were soldered by infrared heating. The heat sources were placed on the top, bottom and both lateral sides of the BGA package. After the solder balls-attach process, a metallographic cross-section was performed, followed by selective etching to visualize the relief of the intermetallic layer. Images of the interfacial between the solder and solder pad were taken from the created samples, followed by measurement of the average thickness and root mean square roughness of the intermetallic layer. The results showed changes in the intermetallic layer. The largest thickness of the intermetallic layer was observed on samples soldered from the top and both sides. Soldering with the bottom infrared heater resulted to the smallest thickness of the intermetallic layer. The same trend was in the roughness of the IMC layer. The greatest roughness was found for samples soldered by the top and both side heaters. The top soldered samples exhibit the smallest roughness.

Keywords

BGA package; reflow soldering; infrared heater; heat flow direction; intermetallic interfacial layer

Authors

OTÁHAL, A.; SZENDIUCH, I.

Released

19. 9. 2018

ISBN

1339-309X

Periodical

Journal of Electrical Engineering

Year of study

69

Number

4

State

Slovak Republic

Pages from

305

Pages to

310

Pages count

5

URL

https://www.degruyter.com/view/j/jee.2018.69.issue-4/jee-2018-0043/jee-2018-0043.xml

Full text in the Digital Library

http://hdl.handle.net/11012/200885

BibTex

@article{BUT150170,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Influence of heat flow direction on solder ball interfacial layer",
  journal="Journal of Electrical Engineering",
  year="2018",
  volume="69",
  number="4",
  pages="305--310",
  doi="10.2478/jee-2018-0043",
  issn="1339-309X",
  url="https://www.degruyter.com/view/j/jee.2018.69.issue-4/jee-2018-0043/jee-2018-0043.xml"
}