Detail publikace

Influence of heat flow direction on solder ball interfacial layer

OTÁHAL, A. SZENDIUCH, I.

Originální název

Influence of heat flow direction on solder ball interfacial layer

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were soldered by infrared heating. The heat sources were placed on the top, bottom and both lateral sides of the BGA package. After the solder balls-attach process, a metallographic cross-section was performed, followed by selective etching to visualize the relief of the intermetallic layer. Images of the interfacial between the solder and solder pad were taken from the created samples, followed by measurement of the average thickness and root mean square roughness of the intermetallic layer. The results showed changes in the intermetallic layer. The largest thickness of the intermetallic layer was observed on samples soldered from the top and both sides. Soldering with the bottom infrared heater resulted to the smallest thickness of the intermetallic layer. The same trend was in the roughness of the IMC layer. The greatest roughness was found for samples soldered by the top and both side heaters. The top soldered samples exhibit the smallest roughness.

Klíčová slova

BGA package; reflow soldering; infrared heater; heat flow direction; intermetallic interfacial layer

Autoři

OTÁHAL, A.; SZENDIUCH, I.

Vydáno

19. 9. 2018

ISSN

1339-309X

Periodikum

Journal of Electrical Engineering

Ročník

69

Číslo

4

Stát

Slovenská republika

Strany od

305

Strany do

310

Strany počet

5

URL

https://www.degruyter.com/view/j/jee.2018.69.issue-4/jee-2018-0043/jee-2018-0043.xml

Plný text v Digitální knihovně

http://hdl.handle.net/11012/200885

BibTex

@article{BUT150170,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Influence of heat flow direction on solder ball interfacial layer",
  journal="Journal of Electrical Engineering",
  year="2018",
  volume="69",
  number="4",
  pages="305--310",
  doi="10.2478/jee-2018-0043",
  issn="1339-309X",
  url="https://www.degruyter.com/view/j/jee.2018.69.issue-4/jee-2018-0043/jee-2018-0043.xml"
}