Patent detail

Resonance-coupled signaling between IC modules

BURTON, R. PTÁČEK, K.

Patent type

Patent

Abstract

Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first integrated resonator in the first module and a second integrated resonator in the second module, the first and second integrated resonators being resonantly coupled to convey the modulated carrier signal from the transmitter to the receiver.

Keywords

chip-to-chip / coupler / galvanic isolation / high-voltage / isolator / resonator / RF signaling/ RF communication

Patent number

10008457

Date of application

18. 10. 2016

Date of registration

28. 6. 2018

Owner

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Possibilities of use

In order to use the result by another entity, it is always necessary to acquire a license

Licence fee

The licensor requires a license fee for the result

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