Detail patentu

Resonance-coupled signaling between IC modules

BURTON, R. PTÁČEK, K.

Typ patentu

patent

Abstrakt

Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first integrated resonator in the first module and a second integrated resonator in the second module, the first and second integrated resonators being resonantly coupled to convey the modulated carrier signal from the transmitter to the receiver.

Klíčová slova

chip-to-chip / coupler / galvanic isolation / high-voltage / isolator / resonator / RF signaling/ RF communication

Číslo patentu

10008457

Datum přihlášky

18. 10. 2016

Datum zápisu

28. 6. 2018

Vlastník

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Možnosti využití

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