Přístupnostní navigace
E-application
Search Search Close
Publication detail
SZENDIUCH, I. HEJÁTKOVÁ, E. HURBAN, M.
Original Title
Gas flow and heat transfer in reflow oven
Type
conference paper
Language
English
Original Abstract
Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.
Keywords
Reflow soldering, heat transfer coefficient, gas flow, 3D flow measuring.
Authors
SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.
Released
8. 8. 2018
Publisher
IEEE Computer Society
Location
Zlatibor, Serbia
ISBN
2161-2536
Periodical
International Spring Seminar on Electronics Technology ISSE
Year of study
1
Number
State
United States of America
Pages from
254
Pages to
256
Pages count
3
URL
http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919
BibTex
@inproceedings{BUT152057, author="Ivan {Szendiuch} and Edita {Hejátková} and Milan {Hurban}", title="Gas flow and heat transfer in reflow oven", booktitle="2018 41st International Spring Seminar on Electronics Technology", year="2018", journal="International Spring Seminar on Electronics Technology ISSE", volume="1", number="1", pages="254--256", publisher="IEEE Computer Society", address="Zlatibor, Serbia", doi="10.1109/ISSE.2018.8443763", issn="2161-2536", url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919" }