Detail publikace

Gas flow and heat transfer in reflow oven

SZENDIUCH, I. HEJÁTKOVÁ, E. HURBAN, M.

Originální název

Gas flow and heat transfer in reflow oven

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

Klíčová slova

Reflow soldering, heat transfer coefficient, gas flow, 3D flow measuring.

Autoři

SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.

Vydáno

8. 8. 2018

Nakladatel

IEEE Computer Society

Místo

Zlatibor, Serbia

ISSN

2161-2536

Periodikum

International Spring Seminar on Electronics Technology ISSE

Ročník

1

Číslo

1

Stát

Spojené státy americké

Strany od

254

Strany do

256

Strany počet

3

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919

BibTex

@inproceedings{BUT152057,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Milan {Hurban}",
  title="Gas flow and heat transfer in reflow oven",
  booktitle="2018 41st International Spring Seminar on Electronics Technology",
  year="2018",
  journal="International Spring Seminar on Electronics Technology ISSE",
  volume="1",
  number="1",
  pages="254--256",
  publisher="IEEE Computer Society",
  address="Zlatibor, Serbia",
  doi="10.1109/ISSE.2018.8443763",
  issn="2161-2536",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919"
}