Publication detail

CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling

JAVID, M., BURTON, R., PTÁČEK, K., KITCHEN, J.

Original Title

CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling

Type

conference paper

Language

English

Original Abstract

In this work, a high voltage (HV) galvanically isolated chip-to-chip communication circuit utilizing laterally coupled resonators is reported. The adjacently placed resonators provide high voltage galvanic isolation (GI) using horizontal space between resonators filled with oxide, which minimizes the need for thick inter-metal dielectrics. A previously unexplored application for lateral coupling is introduced as a passive communication channel for GIs. Magnetic coupling between resonators is used to transfer an upconverted digitally-modulated OOK control signal at 2.8 GHz through the galvanic isolator. This proposed method can be integrated using CMOS processes, without altering the native process or adding extra fabrication steps. The system is realized in a 0.25 μm BCD (Bipolar-CMOS-DMOS) process with only four metal layers for proof of concept. The design does not require exotic packaging and provides 3.3 kV RMS isolation, small physical area of 0.95 mm 2 , and sub-20 ns propagation delay. The implemented resonators inherently act as bandpass filters, thus enhancing circuit noise immunity to common mode transients.

Keywords

CMOS integrated circuits, Isolators, Passives, Radio frequency, System-on-chip, Transformer

Authors

JAVID, M., BURTON, R., PTÁČEK, K., KITCHEN, J.

Released

7. 7. 2017

Publisher

IEEE

Location

Piscataway

ISBN

978-1-5090-4626-3

Book

2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

Pages from

252

Pages to

255

Pages count

4

URL

https://ieeexplore.ieee.org/document/7969065

BibTex

@inproceedings{BUT161093,
  author="Karel {Ptáček}",
  title="CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling",
  booktitle="2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)",
  year="2017",
  pages="252--255",
  publisher="IEEE",
  address="Piscataway",
  doi="10.1109/RFIC.2017.7969065",
  isbn="978-1-5090-4626-3",
  url="https://ieeexplore.ieee.org/document/7969065"
}