Detail publikace

CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling

JAVID, M., BURTON, R., PTÁČEK, K., KITCHEN, J.

Originální název

CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

In this work, a high voltage (HV) galvanically isolated chip-to-chip communication circuit utilizing laterally coupled resonators is reported. The adjacently placed resonators provide high voltage galvanic isolation (GI) using horizontal space between resonators filled with oxide, which minimizes the need for thick inter-metal dielectrics. A previously unexplored application for lateral coupling is introduced as a passive communication channel for GIs. Magnetic coupling between resonators is used to transfer an upconverted digitally-modulated OOK control signal at 2.8 GHz through the galvanic isolator. This proposed method can be integrated using CMOS processes, without altering the native process or adding extra fabrication steps. The system is realized in a 0.25 μm BCD (Bipolar-CMOS-DMOS) process with only four metal layers for proof of concept. The design does not require exotic packaging and provides 3.3 kV RMS isolation, small physical area of 0.95 mm 2 , and sub-20 ns propagation delay. The implemented resonators inherently act as bandpass filters, thus enhancing circuit noise immunity to common mode transients.

Klíčová slova

CMOS integrated circuits, Isolators, Passives, Radio frequency, System-on-chip, Transformer

Autoři

JAVID, M., BURTON, R., PTÁČEK, K., KITCHEN, J.

Vydáno

7. 7. 2017

Nakladatel

IEEE

Místo

Piscataway

ISBN

978-1-5090-4626-3

Kniha

2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

Strany od

252

Strany do

255

Strany počet

4

URL

https://ieeexplore.ieee.org/document/7969065

BibTex

@inproceedings{BUT161093,
  author="Karel {Ptáček}",
  title="CMOS integrated galvanically isolated RF chip-to-chip communication utilizing lateral resonant coupling",
  booktitle="2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)",
  year="2017",
  pages="252--255",
  publisher="IEEE",
  address="Piscataway",
  doi="10.1109/RFIC.2017.7969065",
  isbn="978-1-5090-4626-3",
  url="https://ieeexplore.ieee.org/document/7969065"
}