Publication detail

Reliability of Solder Joint and SMT Assembly

ŠANDERA, J.

Original Title

Reliability of Solder Joint and SMT Assembly

Type

conference paper

Language

English

Original Abstract

The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented.

Keywords

thermomechanical stress, SMD components, temperature cycling

Authors

ŠANDERA, J.

RIV year

2005

Released

2. 2. 2005

Location

Tarragona, Španělsko

ISBN

0-7803-8811-9

Book

2005-Spanish Conference on Electron Devices

Pages from

25

Pages to

28

Pages count

4

BibTex

@inproceedings{BUT16998,
  author="Josef {Šandera}",
  title="Reliability of Solder Joint and SMT Assembly",
  booktitle="2005-Spanish Conference on Electron Devices",
  year="2005",
  pages="4",
  address="Tarragona, Španělsko",
  isbn="0-7803-8811-9"
}