Přístupnostní navigace
E-application
Search Search Close
Publication detail
ŠANDERA, J.
Original Title
Reliability of Solder Joint and SMT Assembly
Type
conference paper
Language
English
Original Abstract
The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented.
Keywords
thermomechanical stress, SMD components, temperature cycling
Authors
RIV year
2005
Released
2. 2. 2005
Location
Tarragona, Španělsko
ISBN
0-7803-8811-9
Book
2005-Spanish Conference on Electron Devices
Pages from
25
Pages to
28
Pages count
4
BibTex
@inproceedings{BUT16998, author="Josef {Šandera}", title="Reliability of Solder Joint and SMT Assembly", booktitle="2005-Spanish Conference on Electron Devices", year="2005", pages="4", address="Tarragona, Španělsko", isbn="0-7803-8811-9" }