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Rakhymberdina, M.Y., Sadenova, M.A., Kulenova, N.A., Erkinovna, U.M., Klemeš, J.J.
Original Title
Smart green agriculture on industrially polluted agricultural landscapes
Type
conference paper
Language
English
Original Abstract
The article analyzes information on the degree and nature of soil pollution of agricultural land with heavy metals near the territory of metallurgical enterprises. It is proposed to use the soil buffering scale to characterize the soil quality in relation to heavy metals. Based on the calculations, a soil map was constructed with a gradation of the degree of soil pollution depending on the degree of remoteness from the epicenter of pollution. It was shown that the mass of carbon in the soil and the values of cation exchange correlate with the degree of retention of carbon and heavy metals in the soil. In the studied soils of East Kazakhstan, the mass of carbon varies from 1.4 to 2.7 g and the values of cation exchange range from 16.0 to 40.8%. Based on the considered soil factors - soil buffering capacity, carbon content and cation exchange capacity, it was revealed that the most susceptible to heavy metals were leached powerful low-humus chernozems. It was found that by spraying soybeans with fullerenol, an effective process of soil phytoremediation is ensured. © 2021 University of Split, FESB.
Keywords
GIS; Heavy metals; Phytoremediation; Remote sensing; Soil buffering scale; Soil degradation; Soil map
Authors
Released
8. 9. 2021
Publisher
Institute of Electrical and Electronics Engineers Inc.
ISBN
9789532901122
Book
2021 6th International Conference on Smart and Sustainable Technologies (SpliTech)
Pages from
173101
Pages to
Pages count
13
URL
https://ieeexplore.ieee.org/document/9566460
BibTex
@inproceedings{BUT173226, author="Jiří {Klemeš}", title="Smart green agriculture on industrially polluted agricultural landscapes", booktitle="2021 6th International Conference on Smart and Sustainable Technologies (SpliTech)", year="2021", pages="173101--173101", publisher="Institute of Electrical and Electronics Engineers Inc.", doi="10.23919/SpliTech52315.2021.9566460", isbn="9789532901122", url="https://ieeexplore.ieee.org/document/9566460" }