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Rakhymberdina, M.Y., Sadenova, M.A., Kulenova, N.A., Erkinovna, U.M., Klemeš, J.J.
Originální název
Smart green agriculture on industrially polluted agricultural landscapes
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The article analyzes information on the degree and nature of soil pollution of agricultural land with heavy metals near the territory of metallurgical enterprises. It is proposed to use the soil buffering scale to characterize the soil quality in relation to heavy metals. Based on the calculations, a soil map was constructed with a gradation of the degree of soil pollution depending on the degree of remoteness from the epicenter of pollution. It was shown that the mass of carbon in the soil and the values of cation exchange correlate with the degree of retention of carbon and heavy metals in the soil. In the studied soils of East Kazakhstan, the mass of carbon varies from 1.4 to 2.7 g and the values of cation exchange range from 16.0 to 40.8%. Based on the considered soil factors - soil buffering capacity, carbon content and cation exchange capacity, it was revealed that the most susceptible to heavy metals were leached powerful low-humus chernozems. It was found that by spraying soybeans with fullerenol, an effective process of soil phytoremediation is ensured. © 2021 University of Split, FESB.
Klíčová slova
GIS; Heavy metals; Phytoremediation; Remote sensing; Soil buffering scale; Soil degradation; Soil map
Autoři
Vydáno
8. 9. 2021
Nakladatel
Institute of Electrical and Electronics Engineers Inc.
ISBN
9789532901122
Kniha
2021 6th International Conference on Smart and Sustainable Technologies (SpliTech)
Strany od
173101
Strany do
Strany počet
13
URL
https://ieeexplore.ieee.org/document/9566460
BibTex
@inproceedings{BUT173226, author="Jiří {Klemeš}", title="Smart green agriculture on industrially polluted agricultural landscapes", booktitle="2021 6th International Conference on Smart and Sustainable Technologies (SpliTech)", year="2021", pages="173101--173101", publisher="Institute of Electrical and Electronics Engineers Inc.", doi="10.23919/SpliTech52315.2021.9566460", isbn="9789532901122", url="https://ieeexplore.ieee.org/document/9566460" }