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NOVOTNÝ, M., SZENDIUCH, I., BULVA, J.
Original Title
Finite Element Modeling of Surface Mount Devices
Type
conference paper
Language
English
Original Abstract
The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.
Key words in English
finite element modeling, SMD, thermomechanical stressing
Authors
RIV year
2005
Released
1. 1. 2005
Publisher
TU Wien
Location
Wien
ISBN
0-7803-9325-2
Book
Proceedings of ISSE 2005
Edition number
první
Pages from
97
Pages to
101
Pages count
5
BibTex
@inproceedings{BUT17411, author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}", title="Finite Element Modeling of Surface Mount Devices", booktitle="Proceedings of ISSE 2005", year="2005", volume="1", number="první", pages="5", publisher="TU Wien", address="Wien", isbn="0-7803-9325-2" }