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Detail publikace
NOVOTNÝ, M., SZENDIUCH, I., BULVA, J.
Originální název
Finite Element Modeling of Surface Mount Devices
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.
Klíčová slova v angličtině
finite element modeling, SMD, thermomechanical stressing
Autoři
Rok RIV
2005
Vydáno
1. 1. 2005
Nakladatel
TU Wien
Místo
Wien
ISBN
0-7803-9325-2
Kniha
Proceedings of ISSE 2005
Číslo edice
první
Strany od
97
Strany do
101
Strany počet
5
BibTex
@inproceedings{BUT17411, author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}", title="Finite Element Modeling of Surface Mount Devices", booktitle="Proceedings of ISSE 2005", year="2005", volume="1", number="první", pages="5", publisher="TU Wien", address="Wien", isbn="0-7803-9325-2" }