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Publication detail
Novotný M.,Jakubka L.,Szendiuch I.
Original Title
Comparing of flip-chip and wire-bonding interconnection
Type
conference paper
Language
English
Original Abstract
This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.
Keywords
flip chip, wire bonding, ANSYS, termomechanical stress
Authors
RIV year
2006
Released
1. 1. 2006
Publisher
TU Dresden
Location
Dresden
ISBN
00-000-0000-0
Book
29th International Spring Seminar on Electronics Technology, ISSE 2006
Edition number
prvni
Pages from
67
Pages to
70
Pages count
4
BibTex
@inproceedings{BUT18686, author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}", title="Comparing of flip-chip and wire-bonding interconnection", booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006", year="2006", number="prvni", pages="4", publisher="TU Dresden", address="Dresden", isbn="00-000-0000-0" }