Detail publikace

Comparing of flip-chip and wire-bonding interconnection

Novotný M.,Jakubka L.,Szendiuch I.

Originální název

Comparing of flip-chip and wire-bonding interconnection

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

Klíčová slova

flip chip, wire bonding, ANSYS, termomechanical stress

Autoři

Novotný M.,Jakubka L.,Szendiuch I.

Rok RIV

2006

Vydáno

1. 1. 2006

Nakladatel

TU Dresden

Místo

Dresden

ISBN

00-000-0000-0

Kniha

29th International Spring Seminar on Electronics Technology, ISSE 2006

Číslo edice

prvni

Strany od

67

Strany do

70

Strany počet

4

BibTex

@inproceedings{BUT18686,
  author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}",
  title="Comparing of flip-chip and wire-bonding interconnection",
  booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006",
  year="2006",
  number="prvni",
  pages="4",
  publisher="TU Dresden",
  address="Dresden",
  isbn="00-000-0000-0"
}