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Detail publikace
Novotný M.,Jakubka L.,Szendiuch I.
Originální název
Comparing of flip-chip and wire-bonding interconnection
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.
Klíčová slova
flip chip, wire bonding, ANSYS, termomechanical stress
Autoři
Rok RIV
2006
Vydáno
1. 1. 2006
Nakladatel
TU Dresden
Místo
Dresden
ISBN
00-000-0000-0
Kniha
29th International Spring Seminar on Electronics Technology, ISSE 2006
Číslo edice
prvni
Strany od
67
Strany do
70
Strany počet
4
BibTex
@inproceedings{BUT18686, author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}", title="Comparing of flip-chip and wire-bonding interconnection", booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006", year="2006", number="prvni", pages="4", publisher="TU Dresden", address="Dresden", isbn="00-000-0000-0" }