Publication detail

Technological Integration and Challenges Faced by Electronic Industry

SZENDIUCH, I.

Original Title

Technological Integration and Challenges Faced by Electronic Industry

Type

conference paper

Language

English

Original Abstract

Publication deals with new approaches in the developments of modern electronics circuits, systems and equipments

Keywords

packaging, FCH, WLP, assembly and interconnection

Authors

SZENDIUCH, I.

RIV year

2000

Released

1. 1. 2000

Publisher

Ing. Zdeněk Novotný, CSc.

Location

Brno

ISBN

80-214-1780-3

Book

Electronics Devices and Systems Y2K Proceedings.

Pages from

57

Pages to

62

Pages count

9

BibTex

@inproceedings{BUT2038,
  author="Ivan {Szendiuch}",
  title="Technological Integration and Challenges Faced by Electronic Industry",
  booktitle="Electronics Devices and Systems Y2K Proceedings.",
  year="2000",
  pages="57--62",
  publisher="Ing. Zdeněk Novotný, CSc.",
  address="Brno",
  isbn="80-214-1780-3"
}