Detail publikace

Technological Integration and Challenges Faced by Electronic Industry

SZENDIUCH, I.

Originální název

Technological Integration and Challenges Faced by Electronic Industry

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Publication deals with new approaches in the developments of modern electronics circuits, systems and equipments

Klíčová slova

packaging, FCH, WLP, assembly and interconnection

Autoři

SZENDIUCH, I.

Rok RIV

2000

Vydáno

1. 1. 2000

Nakladatel

Ing. Zdeněk Novotný, CSc.

Místo

Brno

ISBN

80-214-1780-3

Kniha

Electronics Devices and Systems Y2K Proceedings.

Strany od

57

Strany do

62

Strany počet

9

BibTex

@inproceedings{BUT2038,
  author="Ivan {Szendiuch}",
  title="Technological Integration and Challenges Faced by Electronic Industry",
  booktitle="Electronics Devices and Systems Y2K Proceedings.",
  year="2000",
  pages="57--62",
  publisher="Ing. Zdeněk Novotný, CSc.",
  address="Brno",
  isbn="80-214-1780-3"
}