Publication detail
Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability
SZENDIUCH, I. HEJÁTKOVÁ, E. NOVOTNÝ, M.
Original Title
Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability
Type
conference paper
Language
English
Original Abstract
deals with influence of lead-free thick film conductive materials on wire bonding
Keywords
lead-free, wire bonding
Authors
SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M.
RIV year
2007
Released
9. 5. 2007
Publisher
TU Dresden
Location
Cluj-Napoca
Pages from
124
Pages to
129
Pages count
6
BibTex
@inproceedings{BUT28357,
author="Ivan {Szendiuch} and Edita {Hejátková} and Marek {Novotný}",
title="Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability",
booktitle="Proceedings ISSE 2007",
year="2007",
pages="124--129",
publisher="TU Dresden",
address="Cluj-Napoca"
}