Publication detail

Elimination of self excited oscillations via changes in the thickness of chips.

BŘEZINA, T. VETIŠKA, J.

Original Title

Elimination of self excited oscillations via changes in the thickness of chips.

Type

conference paper

Language

English

Original Abstract

This paper deals with the possibility of elimination of self-excited oscillations by changing the thickness of chips. These oscillations occur between the tool and machining area during the cutting process without any outer influence. This results into degradation of the machined surface, the geometric accuracy and the noise. A model of cutting process (Eq 1,2) is constructed using the theory of regenerative principle. The model is used to derive analytical formulas for gains of two simple controllers (Fig 2) which control a piezoelectric compensator of the cutting force. The compensator changes the position of cutting tool against the machined surface. This changes the thickness of chips.

Keywords

self-excited oscillations, regenerative principle, vibration compensation

Authors

BŘEZINA, T.; VETIŠKA, J.

RIV year

2009

Released

22. 11. 2009

Publisher

Vilnius Gediminas Technical University

Location

Vilnius

ISBN

978-9955-28-493-2

Book

The 5th International Conference Mechatronic Systems and Materials MSM- 2009

Edition

1

Edition number

1

Pages from

124

Pages to

126

Pages count

2

BibTex

@inproceedings{BUT33818,
  author="Tomáš {Březina} and Jan {Vetiška}",
  title="Elimination of self excited oscillations via changes in the thickness of chips.",
  booktitle="The 5th International Conference Mechatronic Systems and Materials MSM- 2009",
  year="2009",
  series="1",
  number="1",
  pages="124--126",
  publisher="Vilnius Gediminas Technical University",
  address="Vilnius",
  isbn="978-9955-28-493-2"
}