Detail publikace

Elimination of self excited oscillations via changes in the thickness of chips.

BŘEZINA, T. VETIŠKA, J.

Originální název

Elimination of self excited oscillations via changes in the thickness of chips.

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with the possibility of elimination of self-excited oscillations by changing the thickness of chips. These oscillations occur between the tool and machining area during the cutting process without any outer influence. This results into degradation of the machined surface, the geometric accuracy and the noise. A model of cutting process (Eq 1,2) is constructed using the theory of regenerative principle. The model is used to derive analytical formulas for gains of two simple controllers (Fig 2) which control a piezoelectric compensator of the cutting force. The compensator changes the position of cutting tool against the machined surface. This changes the thickness of chips.

Klíčová slova

self-excited oscillations, regenerative principle, vibration compensation

Autoři

BŘEZINA, T.; VETIŠKA, J.

Rok RIV

2009

Vydáno

22. 11. 2009

Nakladatel

Vilnius Gediminas Technical University

Místo

Vilnius

ISBN

978-9955-28-493-2

Kniha

The 5th International Conference Mechatronic Systems and Materials MSM- 2009

Edice

1

Číslo edice

1

Strany od

124

Strany do

126

Strany počet

2

BibTex

@inproceedings{BUT33818,
  author="Tomáš {Březina} and Jan {Vetiška}",
  title="Elimination of self excited oscillations via changes in the thickness of chips.",
  booktitle="The 5th International Conference Mechatronic Systems and Materials MSM- 2009",
  year="2009",
  series="1",
  number="1",
  pages="124--126",
  publisher="Vilnius Gediminas Technical University",
  address="Vilnius",
  isbn="978-9955-28-493-2"
}