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RECMAN, M.
Original Title
Early Access Tools - Integration of TCAD Tools and Fabrication
Type
conference paper
Language
English
Original Abstract
To develop a powerful TCAD( Technology CAD ) package the two main problems are to be solved. The first one is to extract device model parameter values from front-end technological parameters. The second problem to be solved is to calibrate TCAD software to specific tools and process modules to give a fast, accurate and reliable method of evaluating and optimizing process conditions without the need to run numerous test wafers. At present the exploitation of the TCAD tools to solve these problems is under study, and it seems to be just the beginning of a path that provides a new realm of highly accurate device performance modeling. The approaches to integrate process, device and circuit simulation TCAD tools are reviewed and examples to solve these problems by leading TCAD vendors are presented.
Keywords
process simulation, device simulation, circuit simulation, computer-aided design, semiconductor devices modeling
Authors
RIV year
2003
Released
1. 1. 2003
Publisher
Novotný-Brno
Location
Brno
ISBN
80-214-2452-4
Book
Electronic Devices and Systems 2003 - Proceedings
Pages from
270
Pages to
275
Pages count
6
BibTex
@inproceedings{BUT9408, author="Milan {Recman}", title="Early Access Tools - Integration of TCAD Tools and Fabrication", booktitle="Electronic Devices and Systems 2003 - Proceedings", year="2003", pages="6", publisher="Novotný-Brno", address="Brno", isbn="80-214-2452-4" }