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Detail publikace
RECMAN, M.
Originální název
Early Access Tools - Integration of TCAD Tools and Fabrication
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
To develop a powerful TCAD( Technology CAD ) package the two main problems are to be solved. The first one is to extract device model parameter values from front-end technological parameters. The second problem to be solved is to calibrate TCAD software to specific tools and process modules to give a fast, accurate and reliable method of evaluating and optimizing process conditions without the need to run numerous test wafers. At present the exploitation of the TCAD tools to solve these problems is under study, and it seems to be just the beginning of a path that provides a new realm of highly accurate device performance modeling. The approaches to integrate process, device and circuit simulation TCAD tools are reviewed and examples to solve these problems by leading TCAD vendors are presented.
Klíčová slova
process simulation, device simulation, circuit simulation, computer-aided design, semiconductor devices modeling
Autoři
Rok RIV
2003
Vydáno
1. 1. 2003
Nakladatel
Novotný-Brno
Místo
Brno
ISBN
80-214-2452-4
Kniha
Electronic Devices and Systems 2003 - Proceedings
Strany od
270
Strany do
275
Strany počet
6
BibTex
@inproceedings{BUT9408, author="Milan {Recman}", title="Early Access Tools - Integration of TCAD Tools and Fabrication", booktitle="Electronic Devices and Systems 2003 - Proceedings", year="2003", pages="6", publisher="Novotný-Brno", address="Brno", isbn="80-214-2452-4" }