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BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I. SITKO, V.
Original Title
Innovative procedures for the evaluation method of the efficiency in the cleaning process
Type
conference paper
Language
English
Original Abstract
High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.
Keywords
Cleaning process, microelectronics, environment, high-quality cleaning
Authors
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I.; SITKO, V.
RIV year
2015
Released
6. 5. 2015
Publisher
IEEE
Location
Eger, Hungary
ISBN
978-963-313-177-0
Book
Electronics Technology (ISSE), 2015 38th International Spring Seminar
Pages from
288
Pages to
291
Pages count
5
URL
https://ieeexplore.ieee.org/document/7248007
BibTex
@inproceedings{BUT120002, author="BURŠÍK, M. and JANKOVSKÝ, J. and ŘEZNÍČEK, M. and SZENDIUCH, I. and SITKO, V.", title="Innovative procedures for the evaluation method of the efficiency in the cleaning process", booktitle="Electronics Technology (ISSE), 2015 38th International Spring Seminar", year="2015", pages="288--291", publisher="IEEE", address="Eger, Hungary", doi="10.1109/ISSE.2015.7248007", isbn="978-963-313-177-0", url="https://ieeexplore.ieee.org/document/7248007" }