Publication detail

Realization and Simulation of Interconnection of Solar Cell

Jakubka,L., Novotny,M., Szendiuch,I.

Original Title

Realization and Simulation of Interconnection of Solar Cell

Type

conference paper

Language

English

Original Abstract

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Key words in English

Interconnection, Back Side Contact Solar Cell, Reliability, ANSYS

Authors

Jakubka,L., Novotny,M., Szendiuch,I.

RIV year

2006

Released

1. 1. 2006

Publisher

Prof. Vítězslav Benda, PhD.

Location

Praha

ISBN

80-01-03467-4

Book

3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS

Edition number

první

Pages from

119

Pages to

122

Pages count

4

BibTex

@inproceedings{BUT21051,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Realization and Simulation of Interconnection of Solar Cell",
  booktitle="3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS",
  year="2006",
  number="první",
  pages="4",
  publisher="Prof. Vítězslav Benda, PhD.",
  address="Praha",
  isbn="80-01-03467-4"
}