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Publication detail
Novotný, M., Szendiuch, I.
Original Title
Simulation of different substrates connection
Type
conference paper
Language
English
Original Abstract
This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.
Key words in English
Stress, interconnection, ANSYS
Authors
RIV year
2006
Released
1. 1. 2006
Publisher
VUT Brno
Location
Brno
ISBN
80-214-3246-2
Book
Proceedings EDS '06
Edition number
první
Pages from
499
Pages to
503
Pages count
5
BibTex
@inproceedings{BUT24669, author="Marek {Novotný} and Ivan {Szendiuch}", title="Simulation of different substrates connection", booktitle="Proceedings EDS '06", year="2006", number="první", pages="5", publisher="VUT Brno", address="Brno", isbn="80-214-3246-2" }