Course detail

Plasma Chemistry II

FCH-MAO_PLA2Acad. year: 2011/2012

The aim of course is to give the basic knowledge and overview through various plasma chemical processes and technologies that form one of the main platforms of modern High-Tech civilization. The lectures will be given mainly by Czech specialists in different plasma chemical fields. The technologies such the microelectronics production, plasma etching and deposition processes, surface treatment and new material synthesis will be discussed. Besides them the destruction of various chemical compounds by plasma will be presented. The natural plasma and thermonuclear fusion will be presented, too. The actual program for next weeks will be given by mail, e-learning system and on information board.

Language of instruction

English

Number of ECTS credits

3

Mode of study

Not applicable.

Offered to foreign students

Of all faculties

Learning outcomes of the course unit

Overview through plasma chemical processes and technologie and about directions of future development.

Prerequisites

Plasma chemistry/Plazmochemie

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Each student will prepare presentation (about 15 slides) given information of given plasma process or technology. Their list will be presented in the information system. The presentation will be associated with about 2 pages of text linked to presentation. Besides the presentation, the own exament will be a test through the plasma processes and technologies.

Course curriculum

Přehled témat (aktuální nabídka bude průběžně upřesňována):
1. Natural plasma
2. Termonuclear fusion and its perspectives
3. Illumination technique, plasma displays
4. Gas lasers, excimer gas mixtures
5. Electron, atomic and molecular beams
6. Electric arc
7. Switching devices
8. Plasma etching, production of mictoelectronics
9. Reactive particles generation and organic synthesis in plasmas
10. Deposition of hard layers (PACVD, PECVD)
11. Plasma sputtering - magnetron, diode, HF
12. Deposition of protecting DLC layers
13. Surface treatment of polymers (non-polymer forming plasma)
14. Plasma polymeration (polymer forming plasma), grafting
15. Semipermeabil membranes, sensors based on plasma polymers
16. Polymer layers for use in composite materials
17. Corrosion layers reduction
18. Genaration of nano particles in plasmas, nanotechnologies
19. Plasma spraying, plasmatrons
20. Plasma sterilization
21. Laser ablation spectroskopy (LIBS)
22. Destruction of VOC in thermal and non-equilibrium plasmas
23. Discharges in liquids I - principles of discharge generation, generation of shock waves
24. Discharges in liquids II - generation of active particles, destruction of compounds, desinfection
25. Post-discharge and its applications
26. Use of discharges opperating in pulsed regime

Work placements

Not applicable.

Aims

To give the overview of plasma chemical processes and technologies that are one of the main supports of modern and future technologies.

Specification of controlled education, way of implementation and compensation for absences

none

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Basic literature

F. Chen, J. P. Chang: Principles of Plasma Processing, Kluwer Academic/ Plenum Publishers 2003, 0 (EN)

Recommended reading

J.R. Roth: Industrial Plasma Engineering Volume 1: Principles (EN)
J.R. Roth: Industrial Plasma Engineering Volume 2: Applications to Nonthermal Plasma Processing (EN)

Classification of course in study plans

  • Programme NPCP_CHM_INT Master's

    branch NPCO_CHM , 1 year of study, winter semester, elective

  • Programme CKCP_CZV lifelong learning

    branch CKCO_CZV , 1 year of study, winter semester, compulsory-optional

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer