Course detail

Microelectronic technologies

FEKT-DME2Acad. year: 2019/2020

The course is focused on the study of microtechnologies in the form of seminars and self-study. Students will gain an overview of basic and advanced methods and techniques, the use of materials and the rules of microstructure creation. They will be able to orientate in the area of the design and fabrication of thin films and MEMS including the use of micro- and nanotechnologies in microelectronics.

Language of instruction

Czech

Number of ECTS credits

Mode of study

Not applicable.

Guarantor

prof. Ing. Jaromír Hubálek, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Preview of the mehods and techniques in thin-film and semicoductor technology, design skill of the microstructures and nanostructures using advanced techniques of fabrication.

Prerequisites

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Oral exam of the subject will be performed in a present form.

Course curriculum

1. Introduction to microtechnologies (PVD, CVD, micromachining, sandwich structures)
2. Physical Vapor Deposition (thermal evaporation, DC-, ion-, magnetron-, RF-, and reactive sputtering)
3. Chemical Vapor Deposition (LPCVD, MOCVD, epitaxy, ALD, PECVD, diffusion of dopants)
4. Preparation of wafers (polishing, cleaning, piranha, SC1, SC2)
5. Photolithography and resist preparation (resist coating, exposure, development and removal, mask preparation)
6. Wet etching (isotropic and anisotropic etching)
7. Dry etching (ion etching, RIE, DRIE, FIB)
8. Passivation films
9. Selected processes (Lift-off process, League process, Locos process)
10. MEMS technology (volume and surface micromachining, accelerometer and gyroscope construction)
11. MOS technology (basic structure, capacitor, diode, N-MOS, P-MOS, CMOS)
12. Nanotechnology in microelectronics

Work placements

Not applicable.

Aims

Student is going to familiarize with the elemental and advanced methods and techniques for the microstructures and semiconductor devices fabrication, with materials, rules for their creation and modern nanotechnologies in semiconductor industry.

Specification of controlled education, way of implementation and compensation for absences

Not applicable.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

&Actuator Center, California,USA (EN)
Publisher, 2003. (EN)
[1] H.O. Pierson, Handbook of Chemical Vapor Deposition. William Andrew Publishing, LLC Norwish, NY, USA, (EN)
1999, ISBN 0-8155-1432-8 (EN)
[2] S. Sivaram, Chemical Vapor Deposition. International Thomson Publishing Inc., 1995, ISBN 0-442-01079-6 (EN)
[3] M.A. Reed and T. Lee, Molecular Nanoelectronics. American Scientific Publisher, 2003, ISBN 1-58883-006-3 (EN)
[4] MEMS and Nanotechnology Clearinghouse, http://www.memsnet.org (EN)
[5] Courtesy Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov (EN)
[6] Michael Kraft: Micromachined Inertial Sensors Recent Developments at BSAC, prezentace, Berkeley Sensor (EN)
[7] C.T. Leondes, MEMS/NEMS Handbook: Techniques and Applications, Vol. 1-5. Springer Science, 2006 (EN)
[8] H.S. Nalez, Handbook of Organic-Inorganic Hybrid Materials and Nanocoposities, Vol. 1-2, American Scientific (EN)
[9] TJ. Coutts, Active and Passive Thin Film Device. Academic Press, London 1978, pp.1-858 (EN)

Type of course unit

Seminar

39 hod., optionally

Teacher / Lecturer

prof. Ing. Jaromír Hubálek, Ph.D.

VUT

Faculties

University Institutes

Parts

Microelectronic technologies

Type of course unit