Course detail

Plasma and Dry Nano/Microtechnologies

CEITEC VUT-DS110Acad. year: 2024/2025

The lecture will provide a brief overview of the phenomena that occur in plasma of electric discharges and discuss the basic principles of discharges that are used in microelectronics and industrial surface modification. We will discuss fundamentals of etching and deposition by dry methods. Students will gain information on chemical vapor deposition (CVD), atomic layer deposition (ALD), and physical vapor deposition (PVD) methods, including methods using plasma processes such as plasma etching, plasma surface modification, plasma enhanced chemical vapor deposition (PECVD), and magnetron sputtering. The capabilities of these technologies will be presented using specific examples: etching of very narrow (high-aspect-ratio) structures, surface functionalization, deposition of diamond-like carbon layers, deposition of bioactive plasma polymers, and synthesis of carbon nanomaterials and metal-based nanoparticles. For better understanding, the processes will be demonstrated by experiments. 

Language of instruction

English

Number of ECTS credits

4

Mode of study

Not applicable.

Entry knowledge

Fundamentals of gas kinetics.

Rules for evaluation and completion of the course

Students will prepare written answers to the questions covering the course topics at home, and the answers will be discussed during the oral exam.


Aims

Not applicable.

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Handbook of Nanotechnology, Ed. B. Bhushan, Springer 2010 (EN)
Lecture Notes on Principles of Plasma Processing, F. F. Chen, J. P. Chang, Plenum 2002 (EN)
Thin-Film Deposition, Principles and Practice by Donald L. Smith, McGraw-Hill, 1995 (EN)

Recommended reading

Handbook of Plasma Immersion Ion Implantation and Deposition, Ed. A. Anders, Wiley 2000 (EN)
Principles of Plasma Discharges and Material Processing, M. A. Lieberman, A. J. Lichtenberg, Wiley 1994 (EN)