Detail publikace

Computational Modeling of Porous Ceramics with Bioactive Layer

MARCIÁN, P. VALÁŠEK, J. HRSTKA, M. MAJER, Z. ŠEVEČEK, O. PROFANT, T. DLOUHÝ, I. FLORIAN, Z.

Originální název

Computational Modeling of Porous Ceramics with Bioactive Layer

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper deals with a creation of computational model of a high porous ceramic material. This type of material has a large-scale industrial utilization. The computational model was created based on micro-CT data in the ANSYS 14.0 software using Finite Element Method. A creation of a porous ceramic struts model which respect a micro architecture is quite difficult (computer demanding and micro-CT data). The micro-CT slices are converted into a 3D model using image processing (used software STL Model Creator). The local first principle stress was analyzed because, ceramic is the brittle material. Furthermore, the influence of the thick layer around the individual struts was analyzed.

Klíčová slova

Foams Ceramic; Finite Elements Method; Image Processing; Stress – Strain Analysis; Micro-CT

Autoři

MARCIÁN, P.; VALÁŠEK, J.; HRSTKA, M.; MAJER, Z.; ŠEVEČEK, O.; PROFANT, T.; DLOUHÝ, I.; FLORIAN, Z.

Rok RIV

2014

Vydáno

6. 1. 2014

Nakladatel

Trans Tech Publications

Místo

Switzerland

ISBN

978-3-03785-934-6

Kniha

MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE VII

ISSN

1013-9826

Periodikum

Key Engineering Materials (print)

Ročník

592-593

Číslo

2014

Stát

Švýcarská konfederace

Strany od

378

Strany do

381

Strany počet

4

BibTex

@inproceedings{BUT100903,
  author="Petr {Marcián} and Jiří {Valášek} and Miroslav {Hrstka} and Zdeněk {Majer} and Oldřich {Ševeček} and Tomáš {Profant} and Ivo {Dlouhý} and Zdeněk {Florian}",
  title="Computational Modeling of Porous Ceramics with Bioactive Layer",
  booktitle="MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE VII",
  year="2014",
  journal="Key Engineering Materials (print)",
  volume="592-593",
  number="2014",
  pages="378--381",
  publisher="Trans Tech Publications",
  address="Switzerland",
  doi="10.4028/www.scientific.net/KEM.592-593.378",
  isbn="978-3-03785-934-6",
  issn="1013-9826"
}