Ceramic joints for pressure sensors development

článek ve sborníku ve WoS nebo Scopus

angličtina

This article describes the research work related to the ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in electronics industry and motivation for joining ceramics is described in the introduction. Important directions for future research are summarized, with emphasis on the statistical determination of poor joint, and how the modification of a joint technology and process setting affects results and parameters that have been achieved. Main requirements for evaluating quality of joints are described in this paper together with the results of simulations of real ceramic joint application which is ceramic pressure sensor. During manufacturing process of this pressure sensor is one of the most critical part cooling process which was subjected to detail analysis due to number of failures and parasitic deformations revealed after removing assembled and joint pressure sensor from the oven. Our experimental results were evaluated by using the t-test before and after process cooling modification to verify their correctness.

joining, ceramics, pressure sensor, quality, joints

NOVOTNÝ, R.; VLACH, R.; KADLEC, J.; KUCHTA, R.

2013

17. 5. 2013

Society of Photo-Optical Instrumentation Engineers (SPIE)

Grenoble, France

9780819495600

Proceedings of the SPIE, Volume 8763, id. 876309

876309

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