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OTÁHAL, A. ŠIMEK, V. CRHA, A. RŮŽIČKA, R. SZENDIUCH, I.
Originální název
Innovative Methods for Through Holes Plating
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.
Klíčová slova
Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound
Autoři
OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I.
Vydáno
18. 5. 2016
Nakladatel
University of West Bohemia
Místo
Pilsen, Czech Republic
ISBN
978-1-5090-1389-0
Kniha
2016 39th International Spring Seminar on Electronics Technology (ISSE)
ISSN
2161-2536
Periodikum
International Spring Seminar on Electronics Technology ISSE
Stát
Spojené státy americké
Strany od
48
Strany do
52
Strany počet
534
BibTex
@inproceedings{BUT126050, author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}", title="Innovative Methods for Through Holes Plating", booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)", year="2016", journal="International Spring Seminar on Electronics Technology ISSE", pages="48--52", publisher="University of West Bohemia", address="Pilsen, Czech Republic", doi="10.1109/ISSE.2016.7563159", isbn="978-1-5090-1389-0", issn="2161-2536" }