Detail publikace

Comparative Simulations of Hybrid Systems with Nonuniform MTLs via Wendroff and NILT Based Techniques

BRANČÍK, L. AL-ZUBAIDI R-SMITH, N.

Originální název

Comparative Simulations of Hybrid Systems with Nonuniform MTLs via Wendroff and NILT Based Techniques

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper is devoted to the comparison of two approaches for the simulation of hybrid systems which contain parts with both lumped and distributed parameters. A distributed part is represented by a multiconductor transmission line (MTL), nonuniform in general. As a framework for the solution a modified nodal analysis (MNA) is utilized to get initial equations. The first approach is based on a composition of a backward Euler scheme to solve differentialalgebraic equations (DAE), resulting from the lumped part description, and Wendroff method to solve telegraphic partial differential equations (PDE), resulting from the MTL description. The second approach is based on a Laplace transformation which converts telegraphic PDEs to ordinary differential equations (ODE), and DAEs to purely algebraic ones. Then, after incorporation of boundary conditions a numerical inversion of Laplace transforms (NILT) is applied. Both approaches are compared from a point of view of computational efficiency and general applicability.

Klíčová slova

hybrid system; multiconductor transmission line; Wendroff method; Laplace-domain method; numerical inverse Laplace transform; Matlab

Autoři

BRANČÍK, L.; AL-ZUBAIDI R-SMITH, N.

Vydáno

8. 8. 2016

Nakladatel

IEEE

Místo

Shanghai, China

ISBN

978-1-5090-6093-1

Kniha

2016 Progress In Electromagnetics Research Symposium (PIERS)

Strany od

4067

Strany do

4072

Strany počet

6

URL

BibTex

@inproceedings{BUT127551,
  author="Lubomír {Brančík} and Nawfal {Al-Zubaidi R-Smith}",
  title="Comparative Simulations of Hybrid Systems with Nonuniform MTLs via Wendroff and NILT Based Techniques",
  booktitle="2016 Progress In Electromagnetics Research Symposium (PIERS)",
  year="2016",
  pages="4067--4072",
  publisher="IEEE",
  address="Shanghai, China",
  doi="10.1109/PIERS.2016.7735526",
  isbn="978-1-5090-6093-1",
  url="http://piers.org/piers2016Shanghai/"
}