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MELICHAR, T. BYDŽOVSKÝ, J. DUFKA, A.
Originální název
Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.).
Klíčová slova
Wood chips; effect; humidity; mineralogical composition; microstructure; silicate matrix; composite.
Autoři
MELICHAR, T.; BYDŽOVSKÝ, J.; DUFKA, A.
Vydáno
16. 7. 2018
Nakladatel
IOP Publishing
Místo
Great Britain
ISSN
1757-8981
Periodikum
IOP Conference Series: Materials Science and Engineering
Ročník
385
Číslo
1
Stát
Spojené království Velké Británie a Severního Irska
Strany od
Strany do
6
Strany počet
URL
http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035
Plný text v Digitální knihovně
http://hdl.handle.net/11012/137108
BibTex
@inproceedings{BUT149017, author="Tomáš {Melichar} and Jiří {Bydžovský} and Amos {Dufka}", title="Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites", booktitle="Construmat 2018", year="2018", journal="IOP Conference Series: Materials Science and Engineering", volume="385", number="1", pages="1--6", publisher="IOP Publishing", address="Great Britain", doi="10.1088/1757-899X/385/1/012035", issn="1757-8981", url="http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035" }