Interpretation of the nanoscratch test measurements for evaluation of adhesion demonstrated on a-SiCxOy:H films

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Mechanical properties of thin films and especially the adhesion belongs to the crucial engineering parameters necessary to be known to allow those to be industrially and scientifically applied. Option to correctly evaluate adhesion property brings the necessary assurance for demanding film applications such as those in unconventional optics, biochemistry, medicine and semiconductors. Commonly, the evaluation of the adhesion given by nanosratch test results into so called critical normal load (Lc). Critical load as semi-quantitative value is considerably influenced by intrinsic and extrinsic parameters1. Therefore, even small changes in the test setup, or material property (such as film thickness) might cause significant deviation of the measure of the adhesion1. Countering the influence of Young’s modulus, thin film thickness, Poisson’s ratio and friction coefficient lead to the work of adhesion figure, which might bring more appropriate solution2,3. This study brings the comparison of the resulting measure of adhesion given from Lc and the work of adhesion4. The material parameters influence has been well commented and the resolution recommendation has been given especially for the studied plasmochemical deposited a-SiCxOy:H based thin films, prepared from tetravinylsilane monomer and its mixtures with argon and oxygen carrier gasses. Acknowledgement This work was supported in part by the Czech Science Foundation [grant no. 16-09161S] and the BUT Specific Research [grant no. FCH-S-19-5834]. References 1) P. A. Steinmann, Y. Tardy and H. E. Hintermann, Thin Solid Films 154 (1987). 2) P. J. Burnett, D. S. Rickerby, Thin Solid Films 157 (1988). 3) S. J. Bull et al., Surf. Coat. Technol. 36 (1988). 4) E. Palesch, V. Cech, Thin Solid Films 636 (2017).

thin films, PECVD, adhesion, nanoscratch test, work of adhesion

PLICHTA, T.; BRÁNECKÝ, M.; ČECH, V.

8. 11. 2019

Praha