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Detail publikace
PULEC, J. SZENDIUCH, I.
Originální název
Contribution to modeling of stressing in microelectronic structures
Typ
abstrakt
Jazyk
angličtina
Originální abstrakt
Topic of my article is modeling of thermomechanical stressing in modern microelectronic structures. Simulations are made using software ANSYS, which is based on Finite Element Method (FEM). Using this method, thermomechanical stressing in various structures was modeled. After simulations, data evaluation and comparison of yielded results was made to determine amplitudes and differences between stressing in various regions of modeled structure and between individual structures.
Klíčová slova
ANSYS, Stressing, 3D Structures
Autoři
PULEC, J.; SZENDIUCH, I.
Vydáno
12. 5. 2010
Nakladatel
Oficyna Wydawnicza Politechniki Warszawskiej
Místo
Warsaw, Poland
ISBN
978-83-7207-870-4
Kniha
Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.
Číslo edice
1
Strany od
218
Strany do
219
Strany počet
2
BibTex
@misc{BUT61078, author="Jiří {Pulec} and Ivan {Szendiuch}", title="Contribution to modeling of stressing in microelectronic structures", booktitle="Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.", year="2010", edition="1", pages="218--219", publisher="Oficyna Wydawnicza Politechniki Warszawskiej", address="Warsaw, Poland", isbn="978-83-7207-870-4", note="abstract" }