Detail publikace

Analytic method for monitoring of cleaning process efficiency

BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I.

Originální název

Analytic method for monitoring of cleaning process efficiency

Anglický název

Analytic method for monitoring of cleaning process efficiency

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.

Anglický abstrakt

This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.

Klíčová slova

Cleaning, contamination, flux, analyze, monitoring

Klíčová slova v angličtině

Cleaning, contamination, flux, analyze, monitoring

Autoři

BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I.

Rok RIV

2014

Vydáno

20. 8. 2014

Nakladatel

IEEE

Místo

Dresden, Německo

ISBN

978-3-934142-49-7

Kniha

IEEE CONFERENCE PUBLICATIONS

Strany od

341

Strany do

344

Strany počet

4

BibTex

@inproceedings{BUT109630,
  author="Martin {Buršík} and Jaroslav {Jankovský} and Michal {Řezníček} and Ivan {Szendiuch}",
  title="Analytic method for monitoring of cleaning process efficiency",
  booktitle="IEEE CONFERENCE PUBLICATIONS",
  year="2014",
  pages="341--344",
  publisher="IEEE",
  address="Dresden, Německo",
  doi="10.1109/ISSE.2014.6887620",
  isbn="978-3-934142-49-7"
}