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BIOLEK, D. KOLKA, Z. BIOLKOVÁ, V. BIOLEK, Z. KVATINSKY, S.
Originální název
(V)TEAM for SPICE Simulation of Memristive Devices With Improved Numerical Performance
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
angličtina
Originální abstrakt
The paper introduces a set of models of memristive devices for a reliable, accurate and fast analysis of large networks in the SPICE (Simulation Program with Integrated Circuit Emphasis) environment. The modeling starts from the recently introduced TEAM (ThrEshold Adaptive Memristor Model) and VTEAM (Voltage ThrEshold Adaptive Memristor Model). A number of improvements are made towards the stick effect elimination and other numerical renements to make the analysis of large networks fast and accurate. A set of models are proposed that utilize the synergy of several techniques such as window asymmetrization, integration with saturation, state equation preprocessing, scaling, and smoothing. The performance of models is tested in Cadence PSPICE 17.2 and particularly in HSPICE v2017, the latter on a large-scale CNN (Cellular Nonlinear Network) for detecting edges of binary images. The simulations manifest the usability of developed models for fast and reliable operation in networks containing more than one million nodes.
Klíčová slova
Memristor; VTEAM; window function; stick effect; SPICE; cellular nonlinear network
Autoři
BIOLEK, D.; KOLKA, Z.; BIOLKOVÁ, V.; BIOLEK, Z.; KVATINSKY, S.
Vydáno
25. 2. 2021
Nakladatel
IEEE
Místo
USA
ISSN
2169-3536
Periodikum
IEEE Access
Ročník
9
Číslo
2
Stát
Spojené státy americké
Strany od
30242
Strany do
30255
Strany počet
14
URL
https://ieeexplore.ieee.org/document/9354151
Plný text v Digitální knihovně
http://hdl.handle.net/11012/196418
BibTex
@article{BUT170268, author="Dalibor {Biolek} and Zdeněk {Kolka} and Viera {Biolková} and Zdeněk {Biolek} and Shahar {Kvatinsky}", title="(V)TEAM for SPICE Simulation of Memristive Devices With Improved Numerical Performance", journal="IEEE Access", year="2021", volume="9", number="2", pages="30242--30255", doi="10.1109/ACCESS.2021.3059241", issn="2169-3536", url="https://ieeexplore.ieee.org/document/9354151" }