Ministerstvo školství, mládeže a tělovýchovy ČR - Fond rozvoje vysokých škol (FRVŠ)

- whole funder (2003-03-24 - not assigned)

IS1543

Czech

Szendiuch Ivan, doc. Ing., CSc. - principal person responsible

Department of Microelectronics
- beneficiary (2003-03-24 - not assigned)

SZENDIUCH, I. Lead-free Legislation in Electronics Industry. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Ing. Zdeněk Novotný CSc.,Brno, 2004. p. 403 ( p.)ISBN: 80-214-2701-9.
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SZENDIUCH, I. Bezolovnaté pájení. Dny čs techniky, BVV Brno 22.9.2004, Pavilon A. ČR: BVV Brno, 2004. s. 0 ( s.)
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SZENDIUCH, I. Moderní elektronika, bezolovnaté pájení a směrnice EU. In Moderní elektronické součástky 2004. Sborník přednášek, Kongresová hala Holiday Inn, 24. a 25.11.2004. Brno: Sdělovací technika, 2004. s. 11 ( s.)
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SZENDIUCH, I. Investigation of Creep and Stress Relaxation of Lead-free Solder Joints. In 37th IMAPS Symposium on Microelectronics. Long Beach: IMAPS USA, 2004. p. 1-10 ( p.)ISBN: 0-930815-74-2.
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SZENDIUCH, I., STARÝ, J. Some New Results from Investigation of Lead-free Solders Application. In Proceedings of IMAPS Nordic 2004 Annual Conference. Helsingor, Denmark: IMAPS Nordic, 2004. p. 49 ( p.)ISBN: 951-98002-6-3.
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SZENDIUCH, I. Cleaning of Electronic Assemblies - a Modular Approach. In Proceedings of 3rd European Microelectronics and Packaging. Praha: IMAPS, 2004. p. 305 ( p.)ISBN: 80-239-2835-X.
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SZENDIUCH, I. Czech Electronics Sector and Education. In IMAPS Nordic Proceedings. Helsingor: IMAPS Nordic, 2004. p. 232-7 ( p.)ISBN: 951-98002-6-3.
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SZENDIUCH, I., ŠANDERA, J. FR4-ceramic "Z axis" solder joint reliability. In EMPS 2004. Praha: IMAPS, 2004. p. 687 ( p.)ISBN: 80-239-2835-X.
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ŠANDERA, J. FR4 – Ceramic „Z“ Axis Solder Joint Reliability. In Proceedings of 3rd European Microelectronics and Packaging Symposium. Praha: IMAPS CZ&SK, 2004. p. 687 ( p.)ISBN: 80-239-2835-X.
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SZENDIUCH, I. Sítotisk a jeho perspektivy v nanoelektronice. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2004, roč. 2004, č. 45, s. 3 ( s.)ISSN: 1211-6947.
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SZENDIUCH, I. Soldering and lead free solders. Sdělovací technika, 2004, vol. 2004, no. 6, p. 3 ( p.)ISSN: 0036-9942.
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SZENDIUCH, I. Nové trendy v mikroelektronice a EU. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2004, roč. 2004, č. 45, s. 5 ( s.)ISSN: 1211-6947.
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ŠANDERA, J., SZENDIUCH, I. FR4-Ceramic "Z" Axis Solder Interconnection. Journal of Electrical Engineering, 2004, vol. 55, no. 9-10, p. 256 ( p.)ISSN: 1335-3632.
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SZENDIUCH, I., STARÝ, J. To the Lead free Soldering Application Process. International Microelectronics and Packaging Society Workshop. Lanškroun: IMAPS, 2004. p. 1 ( p.)
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SZENDIUCH, I., STARÝ, J. Investigation of Lead free soldering. IMAPS Czech and Slovak Chapter, 2002. p. 1 ( p.)
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SZENDIUCH, I. Chybí název. IMAPS Czech & Slovak Chapter Workshop. Lanškroun: IMAPS Czech & Slovak Chapter, 2004. s. 0-0.
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SZENDIUCH, I., ŠANDERA, J. Soldering and lead free solders. Brno: 2001. p. 89 ( p.)
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SZENDIUCH, I., BULVA, J. Wettability SnPb and Lead-free. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Ing. Zdeněk Novotný CSc.,Brno, 2004. p. 407-411. ISBN: 80-214-2701-9.
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