Publications

• 2023

  CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z. Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. Applied Materials Today, 2023, vol. 31, no. 1, p. 1-12. ISSN: 2352-9407.
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  OTÁHAL, A.; GABLECH, I.; SKÁCEL, J.; SZENDIUCH, I. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage. In Proceedings of the International Spring Seminar on Electronics Technology. 2023. ISBN: 979-8-3503-3484-5.
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• 2022

  KOPŘIVA, P.; OTÁHAL, A. Design of a micromanipulator for repairs of printed circuit boards. In Proceedings II of the 28th Conference STUDENT EEICT 2022 Selected papers. 1. Brno: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2022. p. 40-43. ISBN: 978-80-214-6030-0.
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  OTÁHAL, A. Pájecí stanice s vyhřívanou šablonou pro proces reballing. DPS Elektronika od A do Z, 2022, vol. 13, no. 4, p. 24-25. ISSN: 1805-5044.
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• 2021

  ŠIMONOVÁ, L.; MATĚJKA, M.; KNÁPEK, A.; KRÁLÍK, T.; POKORNÁ, Z.; MIKA, F.; FOŘT, T.; MAN, O.; ŠKARVADA, P.; OTÁHAL, A.; ČUDEK, P. Nanostructures for Achieving Selective Properties of a Thermophotovoltaic Emitter. Nanomaterials, 2021, vol. 11, no. 9, p. 1-14. ISSN: 2079-4991.
  Detail | WWW | Full text in the Digital Library

  FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-Decorated Parylene C Micropillars Designed to Probe Cellular Force. Advanced Materials Interfaces, 2021, vol. 8, no. 6, p. 2001897-1 (2001897-8 p.)ISSN: 2196-7350.
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  OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J. Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2021. p. 1-4. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M. Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2021. p. 1-6. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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  FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-decorated Parylene C micropillars designed to probe cellular force. SENSORS 2021 conference, Milano, Italy, 2021. p. 1 (1 s.).
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• 2020

  BÍLEK, O.; FIALOVÁ, T.; OTÁHAL, A.; ADAM, V.; ŠMERKOVÁ, K.; FOHLEROVÁ, Z. Antibacterial activity of AgNPs-TiO2 nanotubes: influence of different nanoparticle stabilizers. RSC Advances, 2020, vol. 10, no. 72, p. 1-10. ISSN: 2046-2069.
  Detail | WWW | Full text in the Digital Library

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J. Current Load of Thick-film Pastes for Power Applications. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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  FOHLEROVÁ, Z.; ZHU, H.; HUBÁLEK, J.; NI, S.; PODEŠVA, P.; OTÁHAL, A.; NEUŽIL, P.; YOBAS, L. Rapid Characterization of Biomolecules’ Thermal Stability in Segmented Flow-Through Optofluidic Microsystem. Scientific Reports, 2020, vol. 10, no. 1, p. 1-9. ISSN: 2045-2322.
  Detail | WWW | Full text in the Digital Library

• 2019

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. New Possible Way for Brazing of Thick Film Cermet Conductors. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Influence of Electric Current at Solidification of Solder. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Závěrečná výzkumná zpráva DP č. 13. 2019. p. 1-12.
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• 2018

  OTÁHAL, A.; SZENDIUCH, I. Influence of heat flow direction on solder ball interfacial layer. Journal of Electrical Engineering, 2018, vol. 69, no. 4, p. 305-310. ISSN: 1339-309X.
  Detail | WWW | Full text in the Digital Library

  OTÁHAL, A.; SOMER, J.; SZENDIUCH, I. Influence of heating direction on BGA solder balls structure. In Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. 2018. p. 1-4. ISBN: 978-0-9568086-4-6.
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  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A. Creation of Cavities in High-temperature Ceramics. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 249-254. ISSN: 2161-2536.
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  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A.; HEJÁTKOVÁ, E. X-ray Inspection of Ceramic Structures. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 254-257. ISSN: 2161-2536.
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• 2016

  ŘEZNÍČEK, M.; OTÁHAL, A.; BURŠÍK, M.; JANKOVSKÝ, J. System for maintaining the dispense capillary at a constant height above the surface. In 39th International Spring Seminar on Electronics Technology "Printed Electronics and Smart Textiles". International Spring Seminar on Electronics Technology ISSE. Pilsen, Czech Republic: University of West Bohemia in Pilsen, 2016. p. 430-432. ISBN: 978-1-5090-1389- 0. ISSN: 2161-2536.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Inovace procesu pokovení průchozích otvorů v DPS. DPS Elektronika od A do Z, 2016, no. 1/ 2016, p. 2-3. ISSN: 1805-5044.
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  OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I. ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING. Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 610-614. ISBN: 978-80-214-5350-0.
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  OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica-Electrical Engineering, 2016, vol. 60, no. 4, p. 217-222. ISSN: 0324-6000.
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  SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I. The Quality of BGA Solder Joint with Underfill. In Sborník IMAPS flash Conference 2016. ElectroScope - http://www.electroscope.zcu. cz. 2016. p. 19-22. ISBN: 978-80-214-5419- 4. ISSN: 1802-4564.
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  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Odborná zpráva projektu TAČR GAMA č. TG01010054- 7 rok 2016. 2016. p. 1-2.
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  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Sensitive Analysis of IR Heat Emitter for Soldering. In Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 655-659. ISBN: 978-80-214-5350- 0.
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  OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
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  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Designing of infrared heater with homogenous heat transfer. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. International Spring Seminar on Electronics Technology ISSE. Volume 2016- September. Pilsen, Czech Republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. p. 62-65. ISBN: 978-1-5090-1389- 0. ISSN: 2161-2536.
  Detail | WWW

• 2015

  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Influence of the cavities on the PCB mechanical properties. CIRCUIT WORLD, 2015, vol. 41, no. 2, p. 1-6. ISSN: 0305-6120.
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  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Optimalizace návrhu DPS při testování vibracemi. 2015. p. 1-31.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Mechanické testování elektronických sestav. In Mechanické testování elektronických sestav. 1. Brno: Novpress Brno, 2015. p. 1-26. ISBN: 978-80-214-5271- 8.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Optimalizace modelu vícevrstvé DPS při mechanickém testování. DPS Elektronika od A do Z, 2015, vol. 1, no. 6, p. 4-5. ISSN: 1805- 5044.
  Detail | WWW

  SZENDIUCH, I.; SOMER, J.; VALA, R.; ADÁMEK, M.; BURŠÍK, M.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B.; ŘEZNÍČEK, M.; ŘIHÁK, P.; SKÁCEL, J. Moderní mikroelektronické technologie - základ elektronického hardware. 1. 1. Brno: Vysoké učení technické v Brně, FEKT, 2015. 188 p. ISBN: 978-80-214-5293- 0.
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  PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A. Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis. In Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition. 2015. p. 1-4. ISBN: 978-0-9568086-1-5.
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  SZENDIUCH, I.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B. Some Insights to Quality Improvement in Engineering Education System. International Conference on Engineering Education - New Technologies and Innovation for Global Business. 1. Zagreb: MATE Ltd., Zagreb, 2015. p. 25-31. ISBN: 978-953-246-232- 6.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠEFARA, P. MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE. Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. 2015. p. 45-46. ISBN: 978-80-214-5270- 1.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Optimization of Through- hole Plating Method for Prototyping. In Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. ElectroScope - http://www.electroscope.zcu. cz. 2015. p. 54-56. ISBN: 978-80-214-5270- 1. ISSN: 1802-4564.
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  OTÁHAL, A.; PSOTA, B.; SZENDIUCH, I. The Vibration Testing as Tool for Optimizing of Two PCB Connection. In Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology. 2015. p. 339-342. ISBN: 978-963-313-177-0.
  Detail | WWW

  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Odborná zpráva projektu TAČR GAMA č. TG01010054-7 rok 2015. 2015. p. 1 (1 s.).
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• 2014

  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Nové směry v konstrukci plošných spojů a mechanické testování. DPS Elektronika od A do Z, 2014, vol. 5., no. 1, p. 12-15. ISSN: 1805-5044.
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  SZENDIUCH, I.; HEJÁTKOVÁ, E.; PSOTA, B.; OTÁHAL, A. EU Research programs - the Way to the Quality Increase of PhD Study. In ICEE/ ICIT 2014. 1. Riga: iNNER, 2014. p. 26-31. ISBN: 9781479931927.
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  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. INFLUENCE OF THE CAVITIES ON THE PCB MECHANICAL PROPERTIES. In Electronic Devices and Systems, IMAPS CS International Conference 2014. Brno: Vysoké učení technické v Brně, 2014. p. 1-7. ISBN: 978-80-214-4985- 5.
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  OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I. Impact of solder paste drying on the solderability. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 198-201. ISBN: 978-1-4799-4455-2.
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  OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B. Mechanical testing of PCB using computer simulations. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 290-293. ISBN: 978-1-4799-4455-2.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B.; KLAPKA, M. Vibration Testing as a Tool to Optimize the Configuration of the PCBs. In IMAPS Proceedings. 1. San Diego, USA: IMAPS, 2014. p. 50-54. ISBN: 978-0-9909028-0- 5.
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• 2013

  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A.; HEJÁTKOVÁ, E. Board on Board New PCB Configuration Moving in 3D Packaging. In THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013. Vysoké učení technické v Brně: Novapress sro, 2013. p. 224-227. ISBN: 978-80-214-4754- 7.
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  OTÁHAL, A.; SZENDIUCH, I. Study of Atmosphere Influence on BGA Solder Balls Process. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 36, no. 2013, p. 121-126. ISSN: 2161- 2528.
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  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Metodiky mechanického testování elektronických sestav. 2013.
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  OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I. Investigation of the Mechanical Properties of Lead- Free Solder Materials. Key Engineering Materials (web), 2013, vol. 2013, no. 592- 593, p. 453-456. ISSN: 1662- 9795.
  Detail | WWW

  SZENDIUCH, I.; KLAPKA, M.; PSOTA, B.; OTÁHAL, A. Importance of Vibration Testing for New Technological Solutions. In Proceedings EMPC 2013. 1. Grenoble: IMAPS France, 2013. p. 144-148. ISBN: 978-2-9527467-1- 7.
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