Publications

• 2023

  CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z. Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. Applied Materials Today, 2023, vol. 31, no. 1, p. 1-12. ISSN: 2352-9407.
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  OTÁHAL, A.; GABLECH, I.; SKÁCEL, J.; SZENDIUCH, I. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage. In Proceedings of the International Spring Seminar on Electronics Technology. 2023. ISBN: 979-8-3503-3484-5.
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• 2022

  KOPŘIVA, P.; OTÁHAL, A. Design of a micromanipulator for repairs of printed circuit boards. In Proceedings II of the 28th Conference STUDENT EEICT 2022 Selected papers. 1. Brno: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2022. p. 40-43. ISBN: 978-80-214-6030-0.
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  OTÁHAL, A. Pájecí stanice s vyhřívanou šablonou pro proces reballing. DPS Elektronika od A do Z, 2022, vol. 13, no. 4, p. 24-25. ISSN: 1805-5044.
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• 2021

  OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J. Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2021. p. 1-4. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M. Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2021. p. 1-6. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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  FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-decorated Parylene C micropillars designed to probe cellular force. SENSORS 2021 conference, Milano, Italy, 2021. p. 1 (1 s.).
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  FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-Decorated Parylene C Micropillars Designed to Probe Cellular Force. Advanced Materials Interfaces, 2021, vol. 8, no. 6, p. 2001897-1 (2001897-8 p.)ISSN: 2196-7350.
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  ŠIMONOVÁ, L.; MATĚJKA, M.; KNÁPEK, A.; KRÁLÍK, T.; POKORNÁ, Z.; MIKA, F.; FOŘT, T.; MAN, O.; ŠKARVADA, P.; OTÁHAL, A.; ČUDEK, P. Nanostructures for Achieving Selective Properties of a Thermophotovoltaic Emitter. Nanomaterials, 2021, vol. 11, no. 9, p. 1-14. ISSN: 2079-4991.
  Detail | WWW | Full text in the Digital Library

• 2020

  FOHLEROVÁ, Z.; ZHU, H.; HUBÁLEK, J.; NI, S.; PODEŠVA, P.; OTÁHAL, A.; NEUŽIL, P.; YOBAS, L. Rapid Characterization of Biomolecules’ Thermal Stability in Segmented Flow-Through Optofluidic Microsystem. Scientific Reports, 2020, vol. 10, no. 1, p. 1-9. ISSN: 2045-2322.
  Detail | WWW | Full text in the Digital Library

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J. Current Load of Thick-film Pastes for Power Applications. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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  BÍLEK, O.; FIALOVÁ, T.; OTÁHAL, A.; ADAM, V.; ŠMERKOVÁ, K.; FOHLEROVÁ, Z. Antibacterial activity of AgNPs-TiO2 nanotubes: influence of different nanoparticle stabilizers. RSC Advances, 2020, vol. 10, no. 72, p. 1-10. ISSN: 2046-2069.
  Detail | WWW | Full text in the Digital Library

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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• 2019

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Influence of Electric Current at Solidification of Solder. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Závěrečná výzkumná zpráva DP č. 13. 2019. p. 1-12.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. New Possible Way for Brazing of Thick Film Cermet Conductors. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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• 2018

  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A. Creation of Cavities in High-temperature Ceramics. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 249-254. ISSN: 2161-2536.
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  OTÁHAL, A.; SZENDIUCH, I. Influence of heat flow direction on solder ball interfacial layer. Journal of Electrical Engineering, 2018, vol. 69, no. 4, p. 305-310. ISSN: 1339-309X.
  Detail | WWW | Full text in the Digital Library

  OTÁHAL, A.; SOMER, J.; SZENDIUCH, I. Influence of heating direction on BGA solder balls structure. In Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. 2018. p. 1-4. ISBN: 978-0-9568086-4-6.
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  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A.; HEJÁTKOVÁ, E. X-ray Inspection of Ceramic Structures. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 254-257. ISSN: 2161-2536.
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• 2016

  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Designing of infrared heater with homogenous heat transfer. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. International Spring Seminar on Electronics Technology ISSE. Volume 2016- September. Pilsen, Czech Republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. p. 62-65. ISBN: 978-1-5090-1389- 0. ISSN: 2161-2536.
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  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Sensitive Analysis of IR Heat Emitter for Soldering. In Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 655-659. ISBN: 978-80-214-5350- 0.
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  SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I. The Quality of BGA Solder Joint with Underfill. In Sborník IMAPS flash Conference 2016. ElectroScope - http://www.electroscope.zcu. cz. 2016. p. 19-22. ISBN: 978-80-214-5419- 4. ISSN: 1802-4564.
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  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Odborná zpráva projektu TAČR GAMA č. TG01010054- 7 rok 2016. 2016. p. 1-2.
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  OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
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  ŘEZNÍČEK, M.; OTÁHAL, A.; BURŠÍK, M.; JANKOVSKÝ, J. System for maintaining the dispense capillary at a constant height above the surface. In 39th International Spring Seminar on Electronics Technology "Printed Electronics and Smart Textiles". International Spring Seminar on Electronics Technology ISSE. Pilsen, Czech Republic: University of West Bohemia in Pilsen, 2016. p. 430-432. ISBN: 978-1-5090-1389- 0. ISSN: 2161-2536.
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  OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I. ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING. Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 610-614. ISBN: 978-80-214-5350-0.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Inovace procesu pokovení průchozích otvorů v DPS. DPS Elektronika od A do Z, 2016, no. 1/ 2016, p. 2-3. ISSN: 1805-5044.
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  OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica-Electrical Engineering, 2016, vol. 60, no. 4, p. 217-222. ISSN: 0324-6000.
  Detail | WWW

• 2015

  SZENDIUCH, I.; SOMER, J.; VALA, R.; ADÁMEK, M.; BURŠÍK, M.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B.; ŘEZNÍČEK, M.; ŘIHÁK, P.; SKÁCEL, J. Moderní mikroelektronické technologie - základ elektronického hardware. 1. 1. Brno: Vysoké učení technické v Brně, FEKT, 2015. 188 p. ISBN: 978-80-214-5293- 0.
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  OTÁHAL, A.; PSOTA, B.; SZENDIUCH, I. The Vibration Testing as Tool for Optimizing of Two PCB Connection. In Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology. 2015. p. 339-342. ISBN: 978-963-313-177-0.
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  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Influence of the cavities on the PCB mechanical properties. CIRCUIT WORLD, 2015, vol. 41, no. 2, p. 1-6. ISSN: 0305-6120.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Optimization of Through- hole Plating Method for Prototyping. In Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. ElectroScope - http://www.electroscope.zcu. cz. 2015. p. 54-56. ISBN: 978-80-214-5270- 1. ISSN: 1802-4564.
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  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Optimalizace návrhu DPS při testování vibracemi. 2015. p. 1-31.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Optimalizace modelu vícevrstvé DPS při mechanickém testování. DPS Elektronika od A do Z, 2015, vol. 1, no. 6, p. 4-5. ISSN: 1805- 5044.
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  OTÁHAL, A.; SZENDIUCH, I.; ŠEFARA, P. MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE. Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. 2015. p. 45-46. ISBN: 978-80-214-5270- 1.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Mechanické testování elektronických sestav. In Mechanické testování elektronických sestav. 1. Brno: Novpress Brno, 2015. p. 1-26. ISBN: 978-80-214-5271- 8.
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  PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A. Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis. In Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition. 2015. p. 1-4. ISBN: 978-0-9568086-1-5.
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  SZENDIUCH, I.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B. Some Insights to Quality Improvement in Engineering Education System. International Conference on Engineering Education - New Technologies and Innovation for Global Business. 1. Zagreb: MATE Ltd., Zagreb, 2015. p. 25-31. ISBN: 978-953-246-232- 6.
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  ŘEZNÍČEK, M.; JANKOVSKÝ, J.; BURŠÍK, M.; OTÁHAL, A. Odborná zpráva projektu TAČR GAMA č. TG01010054-7 rok 2015. 2015. p. 1 (1 s.).
  Detail

• 2014

  OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B. Mechanical testing of PCB using computer simulations. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 290-293. ISBN: 978-1-4799-4455-2.
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  SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B.; KLAPKA, M. Vibration Testing as a Tool to Optimize the Configuration of the PCBs. In IMAPS Proceedings. 1. San Diego, USA: IMAPS, 2014. p. 50-54. ISBN: 978-0-9909028-0- 5.
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  PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. INFLUENCE OF THE CAVITIES ON THE PCB MECHANICAL PROPERTIES. In Electronic Devices and Systems, IMAPS CS International Conference 2014. Brno: Vysoké učení technické v Brně, 2014. p. 1-7. ISBN: 978-80-214-4985- 5.
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  SZENDIUCH, I.; HEJÁTKOVÁ, E.; PSOTA, B.; OTÁHAL, A. EU Research programs - the Way to the Quality Increase of PhD Study. In ICEE/ ICIT 2014. 1. Riga: iNNER, 2014. p. 26-31. ISBN: 9781479931927.
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  OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I. Impact of solder paste drying on the solderability. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 198-201. ISBN: 978-1-4799-4455-2.
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  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Nové směry v konstrukci plošných spojů a mechanické testování. DPS Elektronika od A do Z, 2014, vol. 5., no. 1, p. 12-15. ISSN: 1805-5044.
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• 2013

  OTÁHAL, A.; SZENDIUCH, I. Study of Atmosphere Influence on BGA Solder Balls Process. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 36, no. 2013, p. 121-126. ISSN: 2161- 2528.
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  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A.; HEJÁTKOVÁ, E. Board on Board New PCB Configuration Moving in 3D Packaging. In THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013. Vysoké učení technické v Brně: Novapress sro, 2013. p. 224-227. ISBN: 978-80-214-4754- 7.
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  SZENDIUCH, I.; KLAPKA, M.; PSOTA, B.; OTÁHAL, A. Importance of Vibration Testing for New Technological Solutions. In Proceedings EMPC 2013. 1. Grenoble: IMAPS France, 2013. p. 144-148. ISBN: 978-2-9527467-1- 7.
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  SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Metodiky mechanického testování elektronických sestav. 2013.
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  OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I. Investigation of the Mechanical Properties of Lead- Free Solder Materials. Key Engineering Materials (web), 2013, vol. 2013, no. 592- 593, p. 453-456. ISSN: 1662- 9795.
  Detail | WWW

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