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Project detail
Duration: 01.01.2006 — 31.07.2009
Funding resources
Ministerstvo průmyslu a obchodu ČR - Projektová konsorcia
- whole funder (2004-06-17 - not assigned)
Mark
FT-TA3/013
Default language
Czech
People responsible
Szendiuch Ivan, doc. Ing., CSc. - principal person responsible
Units
Department of Microelectronics- beneficiary (2004-06-17 - not assigned)
Results
NOVOTNÝ, M.; SZENDIUCH, I. Chip Power Interconnection. In Proceeding of 30th International Spring Seminar on Electronics Technology. Napoca: TU of Cluj Napoca, 2007. p. 183 ( p.)ISBN: 1-4244-1218-8.Detail
VANĚK, J.; HLADÍK, J.; SZENDIUCH, I. Optimization of Propertief of Planar Spiral Inductors. In ISSE 2007 International Spring Seminar on Electronics Technology. Cluj-Napoca, Romania: Editura Mediamira, 2007. p. 120-122. ISBN: 978-973-713-174-4.Detail
NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I. Wire Bonding Power Interconnection. In Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one. Finsko: 2007. p. 92-94. ISBN: 978-952-99751-1-2.Detail
Ivan Szendiuch, Jaroslav Jankovský, Marek Novotný. Perspektivní metody pouzdření polovodičových čipů. In BULETIN ANOTACÍ. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT-info konsorcium, 2007. s. 22 ( s.)ISSN: 1211-6947.Detail
NOVOTNÝ, M.; SZENDIUCH, I. Methods of Chip Interconnection. In Electronics Devices and Systems 07 Proceedings. Brno: Ing. Zdeněk Novotný CSc., 2007. p. 260-264. ISBN: 978-80-214-3470-7.Detail
SZENDIUCH, I. Eco-design as the Tool for Decreasing the Impact of Electronic Technology on Environment. In Proceedings IMAPS 2007. San Jose: IMAPS USA, 2007. s. 250-255. ISBN: 0-930815-82-3.Detail
SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z. Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections. In Proceedings IDT'07. Cairo: 2007. p. 242-245. ISBN: 978-1-4244-1824-4.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M. Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability. In Proceedings ISSE 2007. Cluj-Napoca: TU Dresden, 2007. p. 124-129.Detail
SZENDIUCH, I. Curicullum for Lead-free Soldering. In Electronic Devices and Systems EDS 07. Brno: Ing. Zdeněk Novotný, 2007. p. 265-270. ISBN: 978-80-214-3470-7.Detail
SZENDIUCH, I.; VAŠKO, C. Multidisciplinary Aspects in Micro(Nano)electronics Technology Education. In Proceedings of the ICEE 2007. Coimbra: FCTUC, 2007. p. 144-149. ISBN: 978-972-8055-14-1.Detail
SZENDIUCH, I. Roadmap of Lead-free Soldering. In Proceedings ISSE 2007. 1. Cluj-Napoca: TU Dresden, 2007. p. 55-60. ISBN: 978-973-713-174-4.Detail
Szendiuch I., Prokop R.: FyzCON; Prototyp integrovaného obvodu pro měření fyzikálních vlastností kontaktů IO. Brno. (funkční vzorek)Detail
NOVOTNÝ, M.; JANKOVSKÝ, J.; SZENDIUCH, I.: Tester výkonových spojů; Testovací zařízení pro výzkum výkonově kontaktovaných čipů. UMEL. (funkční vzorek)Detail