Project detail

*MERIT - Measurement environment for the reliability study of interconnection technologies.

Duration: 01.01.2006 — 31.07.2009

Funding resources

Ministerstvo průmyslu a obchodu ČR - Projektová konsorcia

- whole funder (2004-06-17 - not assigned)

Mark

FT-TA3/013

Default language

Czech

People responsible

Szendiuch Ivan, doc. Ing., CSc. - principal person responsible

Units

Department of Microelectronics
- beneficiary (2004-06-17 - not assigned)

Results

NOVOTNÝ, M.; SZENDIUCH, I. Chip Power Interconnection. In Proceeding of 30th International Spring Seminar on Electronics Technology. Napoca: TU of Cluj Napoca, 2007. p. 183 ( p.)ISBN: 1-4244-1218-8.
Detail

VANĚK, J.; HLADÍK, J.; SZENDIUCH, I. Optimization of Propertief of Planar Spiral Inductors. In ISSE 2007 International Spring Seminar on Electronics Technology. Cluj-Napoca, Romania: Editura Mediamira, 2007. p. 120-122. ISBN: 978-973-713-174-4.
Detail

NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I. Wire Bonding Power Interconnection. In Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one. Finsko: 2007. p. 92-94. ISBN: 978-952-99751-1-2.
Detail

Ivan Szendiuch, Jaroslav Jankovský, Marek Novotný. Perspektivní metody pouzdření polovodičových čipů. In BULETIN ANOTACÍ. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT-info konsorcium, 2007. s. 22 ( s.)ISSN: 1211-6947.
Detail

NOVOTNÝ, M.; SZENDIUCH, I. Methods of Chip Interconnection. In Electronics Devices and Systems 07 Proceedings. Brno: Ing. Zdeněk Novotný CSc., 2007. p. 260-264. ISBN: 978-80-214-3470-7.
Detail

SZENDIUCH, I. Eco-design as the Tool for Decreasing the Impact of Electronic Technology on Environment. In Proceedings IMAPS 2007. San Jose: IMAPS USA, 2007. s. 250-255. ISBN: 0-930815-82-3.
Detail

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z. Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections. In Proceedings IDT'07. Cairo: 2007. p. 242-245. ISBN: 978-1-4244-1824-4.
Detail

SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M. Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability. In Proceedings ISSE 2007. Cluj-Napoca: TU Dresden, 2007. p. 124-129.
Detail

SZENDIUCH, I. Curicullum for Lead-free Soldering. In Electronic Devices and Systems EDS 07. Brno: Ing. Zdeněk Novotný, 2007. p. 265-270. ISBN: 978-80-214-3470-7.
Detail

SZENDIUCH, I.; VAŠKO, C. Multidisciplinary Aspects in Micro(Nano)electronics Technology Education. In Proceedings of the ICEE 2007. Coimbra: FCTUC, 2007. p. 144-149. ISBN: 978-972-8055-14-1.
Detail

SZENDIUCH, I. Roadmap of Lead-free Soldering. In Proceedings ISSE 2007. 1. Cluj-Napoca: TU Dresden, 2007. p. 55-60. ISBN: 978-973-713-174-4.
Detail

Szendiuch I., Prokop R.: FyzCON; Prototyp integrovaného obvodu pro měření fyzikálních vlastností kontaktů IO. Brno. (funkční vzorek)
Detail

NOVOTNÝ, M.; JANKOVSKÝ, J.; SZENDIUCH, I.: Tester výkonových spojů; Testovací zařízení pro výzkum výkonově kontaktovaných čipů. UMEL. (funkční vzorek)
Detail