Course detail

Microelectronic technologies

FEKT-DME2Acad. year: 2018/2019

The subject is focused on a study of the microelectronic technologies using seminary and self-study. Students will take-up overview about elemental and advanced methods and techniques, material utilization, and rules for microstructure creation. They will know how to take bearings in areas of the design and fabrication, as well about utilization of nanotechnologies in microelectronics.

Language of instruction

Czech

Number of ECTS credits

Mode of study

Not applicable.

Guarantor

prof. Ing. Jaromír Hubálek, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Preview of the mehods and techniques in thin-film and semicoductor technology, design skill of the microstructures and nanostructures using advanced techniques of fabrication.

Prerequisites

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

oral examine

Course curriculum

1. Elemental methods for the thin-film deposition,
2. Materials in the thin-film technology,
3. Topology design, lithography,
4. Anisotropic and isotropic etching of the microstructures,
5. The thermal and chemical oxidation,
6. Anodization,
7. Impurity diffusion,
8. Passive layers,
9. Modern methods of the microstructure creation,
10. MEMS,
11. Nanotechnology
12. Nanoelectronics,
13. NEMS.

Work placements

Not applicable.

Aims

Student is going to familiarize with the elemental and advanced methods and techniques for the microstructures and semiconductor devices fabrication, with materials, rules for their creation and modern nanotechnologies in semiconductor industry.

Specification of controlled education, way of implementation and compensation for absences

Not applicable.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

&Actuator Center, California,USA (EN)
Publisher, 2003. (EN)
[1] H.O. Pierson, Handbook of Chemical Vapor Deposition. William Andrew Publishing, LLC Norwish, NY, USA, (EN)
1999, ISBN 0-8155-1432-8 (EN)
[2] S. Sivaram, Chemical Vapor Deposition. International Thomson Publishing Inc., 1995, ISBN 0-442-01079-6 (EN)
[3] M.A. Reed and T. Lee, Molecular Nanoelectronics. American Scientific Publisher, 2003, ISBN 1-58883-006-3 (EN)
[4] MEMS and Nanotechnology Clearinghouse, http://www.memsnet.org (EN)
[5] Courtesy Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov (EN)
[6] Michael Kraft: Micromachined Inertial Sensors Recent Developments at BSAC, prezentace, Berkeley Sensor (EN)
[7] C.T. Leondes, MEMS/NEMS Handbook: Techniques and Applications, Vol. 1-5. Springer Science, 2006 (EN)
[8] H.S. Nalez, Handbook of Organic-Inorganic Hybrid Materials and Nanocoposities, Vol. 1-2, American Scientific (EN)
[9] TJ. Coutts, Active and Passive Thin Film Device. Academic Press, London 1978, pp.1-858 (EN)

Type of course unit

Seminar

39 hod., optionally

Teacher / Lecturer

prof. Ing. Jaromír Hubálek, Ph.D.

VUT

Faculties

University Institutes

Parts

Microelectronic technologies

Type of course unit